Patent Assignment Details
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| Reel/Frame: | 018563/0374 | |
| Pages: | 6 |
| | Recorded: | 11/30/2006 | | |
| Attorney Dkt #: | 01105/100D165-US1 |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNOR AND THE ASSIGNEE PREVIOUSLY RECORDED ON REEL 018490 FRAME 0902. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNOR ASSIGNS TO ASSIGNEES A FIFTY PERCENT (50%) UNDIVIDED INTEREST EACH. |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/12/2002
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Application #:
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09693255
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Filing Dt:
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10/20/2000
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Title:
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METHOD FOR BONDING A FLEXIBLE SUBSTRATE TO A CHIP
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Assignees
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| REINICKESTR. 8 |
| FALKENSEE, GERMANY D-14612 |
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| AM SCHLANGENHORST 15-17 |
| NAUEN, GERMANY D-14641 |
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Correspondence name and address
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DAVID LEASON
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P.O. BOX 5257
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NEW YORK, NY 10150-5257
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