Total properties:
29
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Patent #:
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Issue Dt:
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11/11/2014
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Application #:
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13883231
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Filing Dt:
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07/12/2013
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Publication #:
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Pub Dt:
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10/24/2013
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Title:
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METHOD FOR CHIP PACKAGING
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Patent #:
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Issue Dt:
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06/07/2016
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Application #:
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13883399
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Filing Dt:
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05/03/2013
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Publication #:
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Pub Dt:
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08/29/2013
| | | | |
Title:
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METHOD FOR CHIP PACKAGE
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Patent #:
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Issue Dt:
|
04/26/2016
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Application #:
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13981116
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Filing Dt:
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07/23/2013
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Publication #:
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Pub Dt:
|
11/14/2013
| | | | |
Title:
|
PACKAGING METHOD
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Patent #:
|
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Issue Dt:
|
11/15/2016
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Application #:
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13981123
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Filing Dt:
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07/23/2013
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Publication #:
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Pub Dt:
|
11/14/2013
| | | | |
Title:
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PACKAGING STRUCTURE
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Patent #:
|
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Issue Dt:
|
03/14/2017
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Application #:
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13984876
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Filing Dt:
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08/12/2013
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Publication #:
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Pub Dt:
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12/05/2013
| | | | |
Title:
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3D SYSTEM-LEVEL PACKAGING METHODS AND STRUCTURES
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Patent #:
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Issue Dt:
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05/26/2015
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Application #:
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13984889
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Filing Dt:
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08/12/2013
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Publication #:
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Pub Dt:
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11/28/2013
| | | | |
Title:
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FAN-OUT HIGH-DENSITY PACKAGING METHODS AND STRUCTURES
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Patent #:
|
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Issue Dt:
|
01/10/2017
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Application #:
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13984929
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Filing Dt:
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08/12/2013
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Publication #:
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Pub Dt:
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12/05/2013
| | | | |
Title:
|
SYSTEM-LEVEL PACKAGING METHODS AND STRUCTURES
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Patent #:
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Issue Dt:
|
08/04/2015
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Application #:
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13984967
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Filing Dt:
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08/12/2013
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Publication #:
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Pub Dt:
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12/05/2013
| | | | |
Title:
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THREE-DIMENSIONAL SYSTEM-LEVEL PACKAGING METHODS AND STRUCTURES
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Patent #:
|
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Issue Dt:
|
03/07/2017
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Application #:
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14074598
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Filing Dt:
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11/07/2013
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Publication #:
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Pub Dt:
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05/08/2014
| | | | |
Title:
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SEMICONDUCTOR IC PACKAGING METHODS AND STRUCTURES
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Patent #:
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Issue Dt:
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04/11/2017
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Application #:
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14074637
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Filing Dt:
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11/07/2013
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Publication #:
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Pub Dt:
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05/08/2014
| | | | |
Title:
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SEMICONDUCTOR PACKAGING STRUCTURE AND METHOD FOR FORMING THE SAME
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Patent #:
|
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Issue Dt:
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03/22/2016
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Application #:
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14074687
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Filing Dt:
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11/07/2013
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Publication #:
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Pub Dt:
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05/08/2014
| | | | |
Title:
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SEMICONDUCTOR PACKAGING STRUCTURE AND METHOD
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Patent #:
|
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Issue Dt:
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09/12/2017
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Application #:
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14074697
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Filing Dt:
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11/07/2013
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Publication #:
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Pub Dt:
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05/08/2014
| | | | |
Title:
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SEMICONDUCTOR DEVICE AND FABRICATION METHOD
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|
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Patent #:
|
|
Issue Dt:
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06/28/2016
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Application #:
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14440876
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Filing Dt:
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05/05/2015
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Publication #:
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|
Pub Dt:
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10/22/2015
| | | | |
Title:
|
METAL CONTACT FOR SEMICONDUCTOR DEVICE
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|
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Patent #:
|
|
Issue Dt:
|
03/22/2016
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Application #:
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14441477
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Filing Dt:
|
05/07/2015
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Publication #:
|
|
Pub Dt:
|
10/15/2015
| | | | |
Title:
|
METAL CONTACT FOR CHIP PACKAGING STRUCTURE
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|
|
Patent #:
|
|
Issue Dt:
|
11/01/2016
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Application #:
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14762671
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Filing Dt:
|
07/22/2015
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Publication #:
|
|
Pub Dt:
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12/31/2015
| | | | |
Title:
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PACKAGE STRUCTURE
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|
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Patent #:
|
|
Issue Dt:
|
07/19/2016
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Application #:
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14766504
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Filing Dt:
|
08/07/2015
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Publication #:
|
|
Pub Dt:
|
02/04/2016
| | | | |
Title:
|
METHOD FOR FORMING PACKAGE STRUCTURE
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|
|
Patent #:
|
|
Issue Dt:
|
12/06/2016
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Application #:
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14780233
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Filing Dt:
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09/25/2015
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Publication #:
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|
Pub Dt:
|
02/11/2016
| | | | |
Title:
|
Semiconductor Packaging Structure And Forming Method Therefor
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|
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Patent #:
|
|
Issue Dt:
|
11/22/2016
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Application #:
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14926649
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Filing Dt:
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10/29/2015
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Publication #:
|
|
Pub Dt:
|
05/05/2016
| | | | |
Title:
|
FLIP-CHIP ON LEADFRAME SEMICONDUCTOR PACKAGING STRUCTURE AND FABRICATION METHOD THEREOF
|
|
|
Patent #:
|
|
Issue Dt:
|
11/06/2018
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Application #:
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14926961
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Filing Dt:
|
10/29/2015
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Publication #:
|
|
Pub Dt:
|
05/05/2016
| | | | |
Title:
|
TESTING PROBE AND SEMICONDUCTOR TESTING FIXTURE, AND FABRICATION METHODS THEREOF
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|
|
Patent #:
|
|
Issue Dt:
|
06/26/2018
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Application #:
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14927169
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Filing Dt:
|
10/29/2015
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Publication #:
|
|
Pub Dt:
|
05/05/2016
| | | | |
Title:
|
TESTING PROBE AND SEMICONDUCTOR TESTING FIXTURE, AND FABRICATION METHODS THEREOF
|
|
|
Patent #:
|
|
Issue Dt:
|
09/04/2018
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Application #:
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14927642
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Filing Dt:
|
10/30/2015
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Publication #:
|
|
Pub Dt:
|
05/05/2016
| | | | |
Title:
|
TESTING PROBE, SEMICONDUCTOR TESTING FIXTURE AND FABRICATION METHOD THEREOF
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|
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Patent #:
|
|
Issue Dt:
|
06/19/2018
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Application #:
|
14927693
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Filing Dt:
|
10/30/2015
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Publication #:
|
|
Pub Dt:
|
05/05/2016
| | | | |
Title:
|
SEMICONDUCTOR TESTING FIXTURE AND FABRICATION METHOD THEREOF
|
|
|
Patent #:
|
|
Issue Dt:
|
06/26/2018
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Application #:
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14927749
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Filing Dt:
|
10/30/2015
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Publication #:
|
|
Pub Dt:
|
05/05/2016
| | | | |
Title:
|
SEMICONDUCTOR TESTING FIXTURE AND FABRICATION METHOD THEREOF
|
|
|
Patent #:
|
|
Issue Dt:
|
09/06/2016
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Application #:
|
14964869
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Filing Dt:
|
12/10/2015
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Publication #:
|
|
Pub Dt:
|
06/16/2016
| | | | |
Title:
|
METHOD AND STRUCTURE FOR WAFER-LEVEL PACKAGING
|
|
|
Patent #:
|
NONE
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Issue Dt:
|
|
Application #:
|
14967986
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Filing Dt:
|
12/14/2015
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Publication #:
|
|
Pub Dt:
|
06/16/2016
| | | | |
Title:
|
SUBSTRATE WITH A SUPPORTING PLATE AND FABRICATION METHOD THEREOF
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|
|
Patent #:
|
|
Issue Dt:
|
05/30/2017
|
Application #:
|
14971495
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Filing Dt:
|
12/16/2015
|
Publication #:
|
|
Pub Dt:
|
06/16/2016
| | | | |
Title:
|
METHOD AND STRUCTURE FOR WAFER-LEVEL PACKAGING
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
14975894
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Filing Dt:
|
12/21/2015
|
Publication #:
|
|
Pub Dt:
|
06/30/2016
| | | | |
Title:
|
METHOD AND STRUCTURE FOR FAN-OUT WAFER LEVEL PACKAGING
|
|
|
Patent #:
|
NONE
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Issue Dt:
|
|
Application #:
|
14975895
|
Filing Dt:
|
12/21/2015
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Publication #:
|
|
Pub Dt:
|
06/30/2016
| | | | |
Title:
|
METHOD AND STRUCTURE FOR FAN-OUT WAFER LEVEL PACKAGING
|
|
|
Patent #:
|
|
Issue Dt:
|
12/05/2017
|
Application #:
|
15106774
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Filing Dt:
|
06/20/2016
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Publication #:
|
|
Pub Dt:
|
07/20/2017
| | | | |
Title:
|
STRUCTURE AND METHOD OF REINFORCING A CONDUCTOR SOLDERING POINT OF SEMICONDUCTOR DEVICE
|
|