Patent Assignment Details
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Reel/Frame: | 012158/0375 | |
| Pages: | 2 |
| | Recorded: | 09/05/2001 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/02/2004
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Application #:
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09946903
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Filing Dt:
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09/05/2001
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Publication #:
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Pub Dt:
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09/26/2002
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Title:
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SUBSTRATE OF SEMICONDUCTOR PACKAGE
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Assignee
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TANTZU |
NO. 123, SEC. 3, DA FONG ROAD |
TAICHUNG, TAIWAN R.O.C |
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Correspondence name and address
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DIKE, BRONSTEIN, ROBERTS & CUSHMAN,
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IP GROUP; PETER F. CORLESS
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P.O. BOX 9169
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BOSTON, MA
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U.S.A. 02209
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