Patent Assignment Details
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Reel/Frame: | 027269/0375 | |
| Pages: | 4 |
| | Recorded: | 11/22/2011 | | |
Attorney Dkt #: | TSM11-0765 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/31/2019
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Application #:
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13276143
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Filing Dt:
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10/18/2011
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Publication #:
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Pub Dt:
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04/18/2013
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Title:
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Packaging Methods for Semiconductor Devices Including Forming Trenches in Workpiece to Separate Adjacent Packaging Substrates
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Assignee
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NO. 8, LI-HSIN RD. 6 |
SCIENCE-BASED INDUSTRIAL PARK |
HSIN-CHU, TAIWAN 300-77 |
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Correspondence name and address
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SLATER & MATSIL, L.L.P.
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17950 PRESTON ROAD
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SUITE 1000
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DALLAS, TX 75252
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