Patent Assignment Details
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| Reel/Frame: | 053900/0376 | |
| Pages: | 4 |
| | Recorded: | 09/28/2020 | | |
| Attorney Dkt #: | TJKK TO DENSO |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
3
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Patent #:
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Issue Dt:
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04/30/2013
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Application #:
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13150645
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Filing Dt:
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06/01/2011
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Publication #:
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Pub Dt:
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12/06/2012
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Title:
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MULTI-COMPONENT POWER STRUCTURES AND METHODS FOR FORMING THE SAME
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Patent #:
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Issue Dt:
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09/30/2014
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Application #:
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13652037
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Filing Dt:
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10/15/2012
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Publication #:
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Pub Dt:
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04/17/2014
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Title:
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POWER MODULES AND POWER MODULE ARRAYS HAVING A MODULAR DESIGN
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Patent #:
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Issue Dt:
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10/22/2019
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Application #:
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15883897
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Filing Dt:
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01/30/2018
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Publication #:
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Pub Dt:
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08/01/2019
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Title:
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POWER ELECTRONICS ASSEMBLIES WITH CIO BONDING LAYERS AND DOUBLE SIDED COOLING, AND VEHICLES INCORPORATING THE SAME
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Assignee
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| 1-1, SHOWA-CHO |
| KARIYA-CITY, AICHI-PREF, JAPAN 448-8661 |
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Correspondence name and address
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DINSMORE & SHOHL LLP
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900 WILSHIRE DRIVE
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SUITE 300
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TROY, MI 48084
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