USPTO Assignments on the Web

	United States Patent and Trademark Office
	Home\|Site Index\|Search\|Guides\|Contacts\|eBusiness\|eBiz alerts\|News\|Help

Patent Assignment Details

NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Reel/Frame:	024794/0377			Pages:	5
		Recorded:	08/06/2010
Attorney Dkt #:	SIL MATRIX -> SHANDONG
Conveyance:	ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Total properties: 12

Patent #:	7346178	Issue Dt:	03/18/2008	Application #:	10977692	Filing Dt:	10/29/2004
Publication #:	US20060093170	Pub Dt:	05/04/2006
Title:	BACKPLATELESS SILICON MICROPHONE

Patent #:	7329933	Issue Dt:	02/12/2008	Application #:	10977693	Filing Dt:	10/29/2004
Publication #:	US20060093171	Pub Dt:	05/04/2006
Title:	SILICON MICROPHONE WITH SOFTLY CONSTRAINED DIAPHRAGM

Patent #:	7202552	Issue Dt:	04/10/2007	Application #:	11182254	Filing Dt:	07/15/2005
Publication #:	US20070013036	Pub Dt:	01/18/2007
Title:	MEMS PACKAGE USING FLEXIBLE SUBSTRATES, AND METHOD THEREOF

Patent #:	7692288	Issue Dt:	04/06/2010	Application #:	11333579	Filing Dt:	01/17/2006
Publication #:	US20070013052	Pub Dt:	01/18/2007
Title:	MEMS PACKAGING METHOD FOR ENHANCED EMI IMMUNITY USING FLEXIBLE SUBSTRATES

Patent #:	7436054	Issue Dt:	10/14/2008	Application #:	11368172	Filing Dt:	03/03/2006
Publication #:	US20070205492	Pub Dt:	09/06/2007
Title:	MEMS MICROPHONE WITH A STACKED PCB PACKAGE AND METHOD OF PRODUCING THE SAME

Patent #:	7804969	Issue Dt:	09/28/2010	Application #:	11500114	Filing Dt:	08/07/2006
Publication #:	US20080031476	Pub Dt:	02/07/2008
Title:	SILICON MICROPHONE WITH IMPACT PROOF STRUCTURE

Patent #:	8045733	Issue Dt:	10/25/2011	Application #:	11973075	Filing Dt:	10/05/2007
Publication #:	US20090092273	Pub Dt:	04/09/2009
Title:	SILICON MICROPHONE WITH ENHANCED IMPACT PROOF STRUCTURE USING BONDING WIRES

Patent #:	8045734	Issue Dt:	10/25/2011	Application #:	12011519	Filing Dt:	01/28/2008
Publication #:	US20080123878	Pub Dt:	05/29/2008
Title:	BACKPLATELESS SILICON MICROPHONE

Patent #:	8467559	Issue Dt:	06/18/2013	Application #:	12070575	Filing Dt:	02/20/2008
Publication #:	US20090208037	Pub Dt:	08/20/2009
Title:	Silicon microphone without dedicated backplate

Patent #:	7843021	Issue Dt:	11/30/2010	Application #:	12072890	Filing Dt:	02/28/2008
Publication #:	US20090218668	Pub Dt:	09/03/2009
Title:	DOUBLE-SIDE MOUNTABLE MEMS PACKAGE

Patent #:	8013404	Issue Dt:	09/06/2011	Application #:	12287466	Filing Dt:	10/09/2008
Publication #:	US20100090295	Pub Dt:	04/15/2010
Title:	FOLDED LEAD-FRAME PACKAGES FOR MEMS DEVICES

Assignor

Exec Dt:

08/06/2010

Assignee

69TH LONGQUAN ST

FANGZI DEVELOPMENT ZONE, SHANDONG 261200 P.R.O.C.

PEOPLE'S REPUBLIC OF CHINA, CHINA

Correspondence name and address
	SAILE ACKERMAN LLC
	28 DAVIS AVENUE
	POUGHKEEPSIE, NY 12603

Search Results as of: 06/25/2024 05:35 PM

If you have any comments or questions concerning the data displayed, contact PRD / Assignments at 571-272-3350. v.2.6

Web interface last modified: August 25, 2017 v.2.6