Patent Assignment Details
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| Reel/Frame: | 060539/0378 | |
| Pages: | 3 |
| | Recorded: | 07/18/2022 | | |
| Attorney Dkt #: | N&P-51722US1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/02/2024
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Application #:
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17867551
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Filing Dt:
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07/18/2022
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Publication #:
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Pub Dt:
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11/03/2022
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Title:
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METHOD OF USING SURFACE MATERIAL OF MOLDING SURFACE OF MOLD
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Assignee
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| 471, MARUSHIN-CHO, KITA-KU |
| NAGOYA-SHI AICHI, JAPAN 4620063 |
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Correspondence name and address
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COOPER LEGAL GROUP LLC
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1388 RIDGE ROAD, UNIT 1
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HINCKLEY, OH 44233
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09/23/2024 06:48 AM
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