Patent Assignment Details
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Reel/Frame: | 027812/0380 | |
| Pages: | 3 |
| | Recorded: | 03/06/2012 | | |
Attorney Dkt #: | 851663.548 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/20/2015
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Application #:
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13340275
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Filing Dt:
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12/29/2011
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Publication #:
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Pub Dt:
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07/04/2013
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Title:
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APPARATUS AND METHOD FOR PLACING SOLDER BALLS
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Assignee
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28 ANG MO KIO, INDUSTRIAL PARK 2 |
SINGAPORE, SINGAPORE 569508 |
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Correspondence name and address
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HAROLD H. BENNETT II
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701 FIFTH AVENUE
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SUITE 5400
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SEATTLE, WA 98104
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