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Patent #:
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Issue Dt:
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05/05/1992
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Application #:
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07576182
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Filing Dt:
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08/30/1990
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Title:
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APPARATUS FOR ISOLATION OF FLUX MATERIALS IN "FLIP-CHIP" MANUFACTURING
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Patent #:
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Issue Dt:
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12/01/1992
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Application #:
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07775009
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Filing Dt:
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10/11/1991
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Title:
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METHOD AND APPARATUS FOR ISOLATION OF FLUX MATERIALS IN FLIP-CHIP MANUFACTURING
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Patent #:
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Issue Dt:
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11/03/1998
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Application #:
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07828468
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Filing Dt:
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01/30/1992
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Title:
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POWER PLANE FOR SEMICONDUCTOR DEVICE
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Patent #:
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Issue Dt:
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11/16/1993
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Application #:
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07834182
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Filing Dt:
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02/07/1992
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Title:
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PARTIALLY-MOLDED, PCB CHIP CARRIER PACKAGE
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Patent #:
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Issue Dt:
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08/23/1994
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Application #:
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07916328
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Filing Dt:
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07/17/1992
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Title:
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METHOD OF INCREASING THE LAYOUT EFFICIENCY OF DIES ON A WAFER AND INCREASING THE RATIO OF I/O AREA TO ACTIVE AREA PER DIE
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Patent #:
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Issue Dt:
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07/12/1994
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Application #:
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07933430
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Filing Dt:
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08/21/1992
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Title:
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SEMICONDUCTOR PACKAGING TECHNIQUE YIELDING INCREASED INNER LEAD COUNT FOR A GIVEN DIE-RECEIVING AREA
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Patent #:
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Issue Dt:
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04/05/1994
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Application #:
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07935449
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Filing Dt:
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08/25/1992
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Title:
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TECHNIQUE OF INCREASING BOND PAD DENSITY ON A SEMICONDUCTOR DIE
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Patent #:
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Issue Dt:
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06/20/2000
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Application #:
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07940157
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Filing Dt:
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09/03/1992
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Title:
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METHOD FOR ASSEMBLING MULTICHIP MODULES
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Patent #:
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Issue Dt:
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09/28/1993
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Application #:
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07947854
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Filing Dt:
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09/18/1992
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Title:
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COMPOSITE BOND PADS FOR SEMICONDUCTOR DEVICES
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Patent #:
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Issue Dt:
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03/21/1995
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Application #:
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07975185
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Filing Dt:
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11/12/1992
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Title:
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MULTI-CHIP SEMICONDUCTOR ARRANGEMENTS USING FLIP CHIP DIES
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Patent #:
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Issue Dt:
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04/05/1994
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Application #:
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07981096
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Filing Dt:
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11/24/1992
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Title:
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METHOD AND APPARATUS FOR ISOLATION OF FLUX MATERIALS IN FLIP-CHIP MANUFACTURING
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Patent #:
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Issue Dt:
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02/08/1994
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Application #:
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07984206
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Filing Dt:
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11/30/1992
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Title:
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SEMICONDUCTOR BOND PADS
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Patent #:
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Issue Dt:
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04/04/1995
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Application #:
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07995644
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Filing Dt:
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12/18/1992
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Title:
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SEMICONDUCTOR DIE HAVING A HIGH DENSITY ARRAY OF COMPOSITE BOND PADS
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Patent #:
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Issue Dt:
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07/18/1995
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Application #:
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08079499
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Filing Dt:
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06/18/1993
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Title:
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PARTIALLY-MOLDED, PCB CHIP CARRIER PACKAGE FOR CERTAIN NON-SQUARE DIE SHAPES
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Patent #:
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Issue Dt:
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09/13/1994
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Application #:
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08105838
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Filing Dt:
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08/12/1993
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Title:
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PREFORMED PLANAR STRUCTURES EMPLOYING EMBEDDED CONDUCTORS
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Patent #:
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Issue Dt:
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02/06/1996
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Application #:
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08106157
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Filing Dt:
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08/12/1993
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Title:
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FLEXIBLE PREFORMED PLANAR STRUCTURES FOR INTERPOSING BETWEEN A CHIP AND A SUBSTRATE
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Patent #:
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Issue Dt:
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11/10/1998
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Application #:
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08111765
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Filing Dt:
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08/25/1993
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Title:
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ARTICLES COMPRISING DOPED SEMICONDUCTOR MATERIAL
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Patent #:
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Issue Dt:
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04/25/1995
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Application #:
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08170102
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Filing Dt:
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12/20/1993
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Title:
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LOCATION AND STANDOFF PINS FOR CHIP ON TAPE
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Patent #:
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Issue Dt:
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07/25/1995
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Application #:
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08192081
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Filing Dt:
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02/04/1994
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Title:
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INTEGRATED CIRCUIT HAVING A COPLANAR SOLDER BALL CONTACT ARRAY
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Patent #:
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Issue Dt:
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05/02/1995
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Application #:
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08194241
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Filing Dt:
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02/10/1994
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Title:
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METHOD AND APPARATUS FOR ISOLATION OF FLUX MATERIALS IN "FLIP-CHIP" MANUFACTURING
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Patent #:
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|
Issue Dt:
|
07/01/1997
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Application #:
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08203919
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Filing Dt:
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03/01/1994
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Title:
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INTEGRATED CIRCUIT PACKAGES WITH DISTINCTIVE COLORATION
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Patent #:
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Issue Dt:
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08/15/1995
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Application #:
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08251058
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Filing Dt:
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05/31/1994
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Title:
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METHOD OF LAYING OUT BOND PADS ON A SEMICONDUCTOR DIE
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Patent #:
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Issue Dt:
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11/21/1995
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Application #:
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08260078
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Filing Dt:
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06/15/1994
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Title:
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PROCESS FOR INTERCONNECTING CONDUCTIVE SUBSTRATES USING AN INTERPOSER HAVING CONDUCTIVE PLASTIC FILLED VIAS
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Patent #:
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Issue Dt:
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11/14/1995
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Application #:
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08299209
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Filing Dt:
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08/31/1994
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Title:
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FIXTURE FOR ATTACHING MULTIPLE LIDS TO MULTI-CHIP MODULE (MCM) INTEGRATED CIRCUIT
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Patent #:
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Issue Dt:
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07/16/1996
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Application #:
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08331251
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Filing Dt:
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10/28/1994
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Title:
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ENCAPSULATION OF ELECTRONIC COMPONENTS
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Patent #:
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|
Issue Dt:
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04/09/1996
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Application #:
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08333168
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Filing Dt:
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11/02/1994
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Title:
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METHOD FOR BUMPING SILICON DEVICES
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Patent #:
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Issue Dt:
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12/10/1996
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Application #:
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08346454
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Filing Dt:
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11/29/1994
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Title:
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METHOD FOR DETECTING A COATING MATERIAL ON A SUBSTRATE
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Patent #:
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Issue Dt:
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03/04/1997
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Application #:
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08359973
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Filing Dt:
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12/20/1994
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Title:
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MULTI-COMPONENT ELECTRONIC DEVICES AND METHODS FOR MAKING THEM
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Patent #:
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|
Issue Dt:
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03/26/1996
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Application #:
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08366539
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Filing Dt:
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12/30/1994
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Title:
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METHOD FOR TESTING SOLDER MASK MATERIAL
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Patent #:
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Issue Dt:
|
02/04/1997
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Application #:
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08378027
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Filing Dt:
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01/24/1995
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Title:
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BARRIER METAL TECHNOLOGY FOR TUNGSTEN PLUG INTERCONNECTION
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Patent #:
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|
Issue Dt:
|
10/15/1996
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Application #:
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08387154
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Filing Dt:
|
02/10/1995
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Title:
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SEMICONDUCTOR BOND PAD STRUCTURE AND INCREASED BOND PAD COUNT PER DIE
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|
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Patent #:
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Issue Dt:
|
03/04/1997
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Application #:
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08393628
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Filing Dt:
|
02/24/1995
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Title:
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PACKAGING MULTI-CHIP MODULES WITHOUT WIRE-BOND INTERCONNECTION
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|
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Patent #:
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|
Issue Dt:
|
03/11/1997
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Application #:
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08412087
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Filing Dt:
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03/27/1995
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Title:
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SEMICONDUCTOR DEVICE PACKAGE FABRICATION METHOD AND APPARATUS
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Patent #:
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|
Issue Dt:
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07/02/1996
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Application #:
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08416457
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Filing Dt:
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04/03/1995
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Title:
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FLOORPLANNING TECHNIQUE USING MULTI-PARTITIONING BASED ON A PARTITION COST FACTOR FOR NON-SQUARE SHAPED PARTITONS
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Patent #:
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Issue Dt:
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11/06/2001
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Application #:
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08424828
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Filing Dt:
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04/19/1995
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Title:
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SUPPORT FOR SEMICONDUCTOR BOND WIRES
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Patent #:
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|
Issue Dt:
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10/29/1996
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Application #:
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08428323
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Filing Dt:
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04/25/1995
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Title:
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PREFORMED PLANAR STRUCTURES FOR SEMICONDUCTOR DEVICE ASSEMBLIES
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Patent #:
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|
Issue Dt:
|
09/17/1996
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Application #:
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08429605
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Filing Dt:
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04/27/1995
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Title:
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OVERMOLDED SEMICONDUCTOR PACKAGE
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Patent #:
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|
Issue Dt:
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06/03/1997
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Application #:
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08430399
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Filing Dt:
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04/28/1995
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Title:
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HIGH DENSITY BOND PAD LAYOUT ARRANGEMENTS FIR SEMICONDUCTOR DIES, AND CONNECTING TO THE BOND PADS
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Patent #:
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|
Issue Dt:
|
05/06/1997
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Application #:
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08430664
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Filing Dt:
|
04/28/1995
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Title:
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ELECTRONIC PACKAGE WITH REDUCED BENDING STRESS
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Patent #:
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Issue Dt:
|
04/08/1997
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Application #:
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08430665
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Filing Dt:
|
04/28/1995
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Title:
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EXTERNALLY BONDABLE OVERMOLDED PACKAGE ARRANGEMENTS
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Patent #:
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|
Issue Dt:
|
01/14/1997
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Application #:
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08432535
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Filing Dt:
|
05/02/1995
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Title:
|
PARTIALLY-MOLDED, PCB CHIP CARRIER PACKAGE FOR CERTAIN NON-SQUARE DIE SHAPES
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|
|
Patent #:
|
|
Issue Dt:
|
12/23/1997
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Application #:
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08434276
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Filing Dt:
|
05/03/1995
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Title:
|
PROCESS FOR MOUNTING A SEMICONDUCTOR DEVICE TO A CIRCUIT SUBBSTRATE
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|
|
Patent #:
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|
Issue Dt:
|
04/22/1997
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Application #:
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08438296
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Filing Dt:
|
05/10/1995
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Title:
|
BONDING SCHEME USING GROUP VB METALLIC LAYER
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|
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Patent #:
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|
Issue Dt:
|
10/13/1998
|
Application #:
|
08470945
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Filing Dt:
|
06/05/1995
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Title:
|
SEMICONDUCTOR DEVICE ASSEMBLY TECHNIQUES USING PREFORMED PLANAR STRUCTURES
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|
|
Patent #:
|
|
Issue Dt:
|
04/28/1998
|
Application #:
|
08476431
|
Filing Dt:
|
06/07/1995
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Title:
|
NON-SQUARE DIE FOR INTEGRATED CIRCUITS AND SYSTEMS CONTAINING THE SAME
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|
|
Patent #:
|
|
Issue Dt:
|
10/15/1996
|
Application #:
|
08479587
|
Filing Dt:
|
06/07/1995
|
Title:
|
METHOD AND APPARATUS FOR ASSEMBLING MULTICHIP MODULES
|
|
|
Patent #:
|
|
Issue Dt:
|
09/02/1997
|
Application #:
|
08484177
|
Filing Dt:
|
06/07/1995
|
Title:
|
ENCAPSULATION OF ELECTRONIC COMPONENTS
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|
|
Patent #:
|
|
Issue Dt:
|
04/14/1998
|
Application #:
|
08485060
|
Filing Dt:
|
06/07/1995
|
Title:
|
MULTIPLE PIN DIE PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
07/08/1997
|
Application #:
|
08486844
|
Filing Dt:
|
06/07/1995
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Title:
|
MULTIFUNCTIONAL CHIP WIRE BONDS
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|
|
Patent #:
|
|
Issue Dt:
|
04/07/1998
|
Application #:
|
08498738
|
Filing Dt:
|
07/06/1995
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Title:
|
CONNECTOR FOR MOUNTING AN ELECTRICAL COMPONENT
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|
|
Patent #:
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|
Issue Dt:
|
04/28/1998
|
Application #:
|
08506164
|
Filing Dt:
|
07/24/1995
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Title:
|
METHOD OF IMPROVING MOLDING OF AN OVERMOLDED PACKAGE BODY ON A SUBSTRATE
|
|
|
Patent #:
|
|
Issue Dt:
|
04/15/1997
|
Application #:
|
08536002
|
Filing Dt:
|
09/29/1995
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Title:
|
HIGH DENSITY CMOS INTEGRATED CIRCUIT WITH HEAT TRANSFER STRUCTURE FOR IMPROVED COOLING
|
|
|
Patent #:
|
|
Issue Dt:
|
12/09/1997
|
Application #:
|
08538629
|
Filing Dt:
|
10/04/1995
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Title:
|
METHOD OF CENTERING A HIGH PRESSURE LID SEAL
|
|
|
Patent #:
|
|
Issue Dt:
|
02/10/1998
|
Application #:
|
08538630
|
Filing Dt:
|
10/04/1995
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Title:
|
HIGH PRESSURE LID SEAL CLIP APPARATUS
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|
|
Patent #:
|
|
Issue Dt:
|
06/10/1997
|
Application #:
|
08538631
|
Filing Dt:
|
10/04/1995
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Title:
|
HIGH CONTACT DENSITY BALL GRID ARRAY PACKAGE FOR FLIP-CHIPS
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|
|
Patent #:
|
|
Issue Dt:
|
05/27/1997
|
Application #:
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08538907
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Filing Dt:
|
10/04/1995
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Title:
|
METHOD OF CENTERING A LID SEAL CLIP
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|
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Patent #:
|
|
Issue Dt:
|
07/28/1998
|
Application #:
|
08539188
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Filing Dt:
|
10/04/1995
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Title:
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CONFIGURABLE BALL GRID ARRAY PACKAGE
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|
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Patent #:
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Issue Dt:
|
02/04/1997
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Application #:
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08539189
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Filing Dt:
|
10/04/1995
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Title:
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CENTERING LID SEAL CLIP APPARATUS
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|
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Patent #:
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|
Issue Dt:
|
12/09/1997
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Application #:
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08542995
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Filing Dt:
|
10/13/1995
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Title:
|
MICROELECTRONIC PACKAGE WITH DEVICE COOLING
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|
|
Patent #:
|
|
Issue Dt:
|
05/12/1998
|
Application #:
|
08549990
|
Filing Dt:
|
10/30/1995
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Title:
|
INTEGRATED CIRCUIT WITH ACTIVE DEVICES UNDER BOND PADS
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|
|
Patent #:
|
|
Issue Dt:
|
02/17/1998
|
Application #:
|
08556599
|
Filing Dt:
|
11/13/1995
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Title:
|
ESD PROTECTION FOR DEEP SUBMICRON CMOS DEVICES WITH MINIMUM TRADEOFF FOR LATCHUP BEHAVIOR
|
|
|
Patent #:
|
|
Issue Dt:
|
06/16/1998
|
Application #:
|
08573892
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Filing Dt:
|
12/18/1995
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Title:
|
SYSTEMS HAVING SHAPED, SELF-ALIGNING MICRO-BUMP STRUCTURES
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|
|
Patent #:
|
|
Issue Dt:
|
11/17/1998
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Application #:
|
08578816
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Filing Dt:
|
12/26/1995
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Title:
|
MULTILAYER STRUCTURES AND PROCESS FOR FABRICATING THE SAME
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|
|
Patent #:
|
|
Issue Dt:
|
09/29/1998
|
Application #:
|
08578966
|
Filing Dt:
|
12/27/1995
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Title:
|
METHOD OF MANUFACTURING POWDERED METAL SINKS HAVING INCREASED SURFACE AREA
|
|
|
Patent #:
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|
Issue Dt:
|
10/06/1998
|
Application #:
|
08580800
|
Filing Dt:
|
12/29/1995
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Title:
|
SYSTEM HAVING INTEGRATED CIRCUIT PACKAGE WITH LEAD FRAME HAVING INTERNAL POWER AND GROUND BUSSES
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|
|
Patent #:
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|
Issue Dt:
|
07/06/1999
|
Application #:
|
08581299
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Filing Dt:
|
12/28/1995
|
Title:
|
SOLDER BONDING OF DENSE ARRAYS OF MICROMINITURE CONTACT PADS
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|
|
Patent #:
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|
Issue Dt:
|
02/09/1999
|
Application #:
|
08595021
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Filing Dt:
|
01/31/1996
|
Title:
|
MICROELECTRONIC DEVICE WITH THIN FILM ELECTROSTATIC DISCHARGE PROTECTION STRUCTURE
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|
|
Patent #:
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|
Issue Dt:
|
08/11/1998
|
Application #:
|
08608679
|
Filing Dt:
|
02/29/1996
|
Title:
|
APPARATUS FOR FORMING ELECTRICAL CONNECTIONS BETWEEN A SEMICONDUCTOR DIE AND A SEMICONDUCTOR PACKAGE
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|
|
Patent #:
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|
Issue Dt:
|
09/01/1998
|
Application #:
|
08615388
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Filing Dt:
|
03/14/1996
|
Title:
|
METHOD OF PACKAGING INTEGRATED CIRCUITS
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|
|
Patent #:
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|
Issue Dt:
|
03/03/1998
|
Application #:
|
08615865
|
Filing Dt:
|
03/14/1996
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Title:
|
METHOD OF FLIP CHIP ASSEMBLY
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|
|
Patent #:
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|
Issue Dt:
|
11/11/1997
|
Application #:
|
08619909
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Filing Dt:
|
03/20/1996
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Title:
|
FLIP CHIP PACKAGE WITH REDUCED NUMBER OF PACKAGE LAYERS
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|
|
Patent #:
|
|
Issue Dt:
|
06/20/2000
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Application #:
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08627411
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Filing Dt:
|
04/01/1996
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Title:
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SYSTEM HAVING HEAT DISSIPATING LEADFRAMES
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Patent #:
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Issue Dt:
|
06/02/1998
|
Application #:
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08632952
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Filing Dt:
|
04/16/1996
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Title:
|
CONDUCTIVE POLYMER BALL ATTACHMENT FOR GRID ARRAY SEMICONDUCTOR PACKAGES
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|
|
Patent #:
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|
Issue Dt:
|
09/16/1997
|
Application #:
|
08633992
|
Filing Dt:
|
04/19/1996
|
Title:
|
METHOD FOR SOLDER-BONDING CONTACT PAD ARRAYS
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|
|
Patent #:
|
|
Issue Dt:
|
03/28/2000
|
Application #:
|
08635288
|
Filing Dt:
|
04/19/1996
|
Title:
|
CHIP ON TAPE DIE REFRAME PROCESS
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|
|
Patent #:
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|
Issue Dt:
|
04/21/1998
|
Application #:
|
08638003
|
Filing Dt:
|
04/25/1996
|
Title:
|
CONDUCTIVE ADHESIVE BONDING MEANS
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|
|
Patent #:
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|
Issue Dt:
|
07/14/1998
|
Application #:
|
08644000
|
Filing Dt:
|
05/07/1996
|
Title:
|
INTEGRATED CIRCUIT UNDERFILL RESERVOIR
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|
Patent #:
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|
Issue Dt:
|
07/13/1999
|
Application #:
|
08646037
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Filing Dt:
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05/07/1996
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Title:
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SUPPORT MEMBER FOR MOUNTING A MICROELECTRONIC CIRCUIT PACKAGE
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Patent #:
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Issue Dt:
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07/07/1998
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Application #:
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08647344
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Filing Dt:
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05/09/1996
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Title:
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SEMICONDUCTOR CHIP PACKAGE WITH INTERCONNECT LAYERS AND ROUTING AND TESTING METHODS
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Patent #:
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Issue Dt:
|
12/23/1997
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Application #:
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08648350
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Filing Dt:
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05/15/1996
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Title:
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METHOD OF PACKAGING AN INTEGRATED CIRCUIT
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Patent #:
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Issue Dt:
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11/25/1997
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Application #:
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08656033
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Filing Dt:
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05/31/1996
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Title:
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WIRE BONDABLE PACKAGE DESIGN WITH MAXIUM ELECTRICAL PERFORMANCE AND MINIMUM NUMBER OF LAYERS
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Patent #:
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Issue Dt:
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09/30/1997
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Application #:
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08663336
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Filing Dt:
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06/13/1996
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Title:
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SEMICONDUCTOR DEVICE HAVING A LAYER OF GALLIUM AMALGAM ON BUMP LEADS
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Patent #:
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Issue Dt:
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03/24/1998
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Application #:
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08664146
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Filing Dt:
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06/14/1996
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Title:
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METHOD OF ASSEMBLING BALL BUMP GRID ARRAY SEMICONDUCTOR PACKAGES
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Patent #:
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Issue Dt:
|
11/10/1998
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Application #:
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08679949
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Filing Dt:
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07/15/1996
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Title:
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OPTICALLY TRANSMISSIVE PREFORMED PLANAR STRUCTURES
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Patent #:
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Issue Dt:
|
03/24/1998
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Application #:
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08692852
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Filing Dt:
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07/24/1996
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Title:
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SEMICONDUCTOR DEVICE HAVING A CARRIER AND A MULTILAYER METALLIZATION
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Patent #:
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Issue Dt:
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07/08/1997
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Application #:
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08697121
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Filing Dt:
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08/20/1996
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Title:
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THIN PACKAGING OF MULTI-CHIP MODULES WITH ENHANCED THERMAL POWER MANAGEMENT
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Patent #:
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|
Issue Dt:
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04/27/1999
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Application #:
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08710573
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Filing Dt:
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09/19/1996
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Title:
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SUPPORT ASSEMBLY FOR MOUNTING AN INTEGRATED CIRCUIT PACKAGE ON A SURFACE
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|
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Patent #:
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Issue Dt:
|
04/27/1999
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Application #:
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08713174
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Filing Dt:
|
09/12/1996
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Title:
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METHOD OF MOUNTING MICROELECTRONIC CIRCUIT PACKAGE
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|
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Patent #:
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|
Issue Dt:
|
05/04/1999
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Application #:
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08717601
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Filing Dt:
|
09/20/1996
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Title:
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FLUXLESS SOLDER BALL ATTACHMENT PROCESS
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|
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Patent #:
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Issue Dt:
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10/27/1998
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Application #:
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08718852
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Filing Dt:
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09/24/1996
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Title:
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METHOD OF MAKING A BARRIER METAL TECHNOLOGY FOR TUNGSTEN PLUG INTERCONNECTION
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|
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Patent #:
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|
Issue Dt:
|
03/24/1998
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Application #:
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08719266
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Filing Dt:
|
09/24/1996
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Title:
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ARRAY OF SOLDER PADS ON AN INTEGRATED CIRCUIT
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|
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Patent #:
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Issue Dt:
|
04/28/1998
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Application #:
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08720219
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Filing Dt:
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09/26/1996
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Title:
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SEMICONDUCTOR PACKAGING TECHNIQUE YIELDING INCREASED INNER LEAD COUNT FOR A GIVEN DIE-RECEIVING AREA
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|
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Patent #:
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Issue Dt:
|
09/21/1999
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Application #:
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08723140
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Filing Dt:
|
10/01/1996
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Title:
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MICROELECTRONIC PACKAGE WITH POLYMER ESD PROTECTION
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|
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Patent #:
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|
Issue Dt:
|
02/17/1998
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Application #:
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08724129
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Filing Dt:
|
09/30/1996
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Title:
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FLIP-CHIP INTEGRATED CIRCUIT WITH IMPROVED TESTABILITY
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|
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Patent #:
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|
Issue Dt:
|
09/14/1999
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Application #:
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08747325
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Filing Dt:
|
11/12/1996
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Title:
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FLIP CHIP BUMP DISTRIBUTION ON DIE
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|
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Patent #:
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|
Issue Dt:
|
05/05/1998
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Application #:
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08761047
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Filing Dt:
|
12/05/1996
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Title:
|
MULTI-CHIP MODULES WITH ISOLATED COUPLING BETWEEN MODULES
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|
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Patent #:
|
|
Issue Dt:
|
02/01/2000
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Application #:
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08764039
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Filing Dt:
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12/12/1996
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Title:
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PROCESS FOR MANUFACTURING A SEMICONDUCTOR DEVICE HAVING STIFFENER MEMBER
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|
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Patent #:
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|
Issue Dt:
|
09/29/1998
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Application #:
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08770872
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Filing Dt:
|
12/20/1996
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Title:
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STACKED INTEGRATED CHIP PACKAGE AND METHOD OF MAKING SAME
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|
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Patent #:
|
|
Issue Dt:
|
10/26/1999
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Application #:
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08771636
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Filing Dt:
|
12/20/1996
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Title:
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APPARATUS AND METHOD FOR STACKABLE MOLDED LEAD FRAME BALL GRID ARRAY PACKAGING OF INTEGRATED CIRCUITS
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|
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Patent #:
|
|
Issue Dt:
|
07/07/1998
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Application #:
|
08771955
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Filing Dt:
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12/23/1996
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Title:
|
USE OF PLASMA ACTIVATED NF3 TO CLEAN SOLDER BUMPS ON A DEVICE
|
|