Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 067568/0382 | |
| Pages: | 11 |
| | Recorded: | 05/30/2024 | | |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE RECEIVING PARTY DATA FROM STATS CHIPPAC PTE. LTE. TO STATS CHIPPAC PTE. LTD. PREVIOUSLY RECORDED AT REEL: 38378 FRAME: 343. ASSIGNOR(S) HEREBY CONFIRMS THE CHANGE OF NAME. |
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Total properties:
2
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Patent #:
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Issue Dt:
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10/30/2007
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Application #:
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11276941
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Filing Dt:
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03/17/2006
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Publication #:
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Pub Dt:
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09/20/2007
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Title:
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INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM
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Patent #:
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Issue Dt:
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07/31/2007
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Application #:
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11307384
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Filing Dt:
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02/04/2006
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Publication #:
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Pub Dt:
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05/17/2007
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Title:
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ETCHED LEADFRAME FLIPCHIP PACKAGE SYSTEM
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Assignee
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| 5 YISHUN STREET 23 |
| SINGAPORE, SINGAPORE |
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Correspondence name and address
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YANGZHOU DU
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8407 CENTRAL AVE, SUITE 2077
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NEWARK, CA 94560-3431
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