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Patent Assignment Details
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Reel/Frame:014502/0384   Pages: 2
Recorded: 09/15/2003
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
01/31/2006
Application #:
10661616
Filing Dt:
09/15/2003
Publication #:
Pub Dt:
08/05/2004
Title:
STACKED CHIP ELECTRONIC PACKAGE HAVING LAMINATE CARRIER AND METHOD OF MAKING SAME
Assignors
1
Exec Dt:
09/11/2003
2
Exec Dt:
09/11/2003
Assignee
1
1701 NORTH STREET
ENDICOTT, NEW YORK 13760
Correspondence name and address
ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
LAWRENCE R. FRALEY
170 NORTH STREET
FBU/257-2 AA12
ENDICOTT, NY 13760

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