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Total properties:
34
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Patent #:
|
|
Issue Dt:
|
04/16/2002
|
Application #:
|
09253441
|
Filing Dt:
|
02/19/1999
|
|
Title:
|
FABRICATION METHODS OF WIRING SUBSTRATE FOR MOUNTING SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE
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Patent #:
|
|
Issue Dt:
|
09/12/2000
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Application #:
|
09341950
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Filing Dt:
|
07/21/1999
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Title:
|
LEAD FRAME MATERIAL
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|
|
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Patent #:
|
|
Issue Dt:
|
08/31/2004
|
Application #:
|
09466895
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Filing Dt:
|
12/20/1999
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|
Title:
|
METHOD FOR FABRICATING A WIRING SUBSTRATE
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|
|
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Patent #:
|
|
Issue Dt:
|
03/04/2003
|
Application #:
|
09685799
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Filing Dt:
|
10/11/2000
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|
Title:
|
WIRING CIRCUIT SUBSTRATE AND MANUFACTURING METHOD THEREOF
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|
|
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Patent #:
|
|
Issue Dt:
|
09/09/2003
|
Application #:
|
10072351
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Filing Dt:
|
02/07/2002
|
|
Publication #:
|
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Pub Dt:
|
07/04/2002
| | | | |
|
Title:
|
FABRICATION METHOD OF WIRING SUBSTRATE FOR MOUNTING SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/07/2004
|
Application #:
|
10139237
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Filing Dt:
|
05/07/2002
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|
Publication #:
|
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Pub Dt:
|
07/31/2003
| | | | |
|
Title:
|
MANUFACTURING METHOD FOR WIRING CIRCUIT SUBSTRATES
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/11/2003
|
Application #:
|
10287633
|
Filing Dt:
|
11/05/2002
|
|
Publication #:
|
|
Pub Dt:
|
08/14/2003
| | | | |
|
Title:
|
WIRING CIRCUIT SUBSTRATE AND MANUFACTURING METHOD THEREFOR
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/26/2005
|
Application #:
|
10358229
|
Filing Dt:
|
02/05/2003
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|
Publication #:
|
|
Pub Dt:
|
08/21/2003
| | | | |
|
Title:
|
CONNECTING MEMBER BETWEEN WIRING FILMS, MANUFACTURING METHOD THEREOF, AND MANUFACTURING METHOD OF MULTILAYER WIRING SUBSTRATE
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|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
10450844
|
Filing Dt:
|
06/26/2003
|
|
Publication #:
|
|
Pub Dt:
|
05/12/2005
| | | | |
|
Title:
|
Multi-layer wiring board, method for producing multi-layer wiring board, polishing machine for multi-layer wiring board, and metal sheet for producing wiring board
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|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
10812349
|
Filing Dt:
|
03/30/2004
|
|
Publication #:
|
|
Pub Dt:
|
10/14/2004
| | | | |
|
Title:
|
Wiring circuit board, manufacturing method for the wiring circuit board, and circuit module
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/29/2006
|
Application #:
|
10823611
|
Filing Dt:
|
04/14/2004
|
|
Publication #:
|
|
Pub Dt:
|
10/07/2004
| | | | |
|
Title:
|
MANUFACTURING METHOD FOR WIRING CIRCUIT SUBSTRATE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/11/2008
|
Application #:
|
10880588
|
Filing Dt:
|
07/01/2004
|
|
Publication #:
|
|
Pub Dt:
|
01/06/2005
| | | | |
|
Title:
|
MULTILAYER WIRING BOARD FOR AN ELECTRONIC DEVICE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/03/2007
|
Application #:
|
11029423
|
Filing Dt:
|
01/06/2005
|
|
Publication #:
|
|
Pub Dt:
|
07/28/2005
| | | | |
|
Title:
|
CONNECTING MEMBER BETWEEN WIRING FILMS, MANUFACTURING METHOD THEREOF, AND MANUFACTURING METHOD OF MULTILAYER WIRING SUBSTRATE
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
11085108
|
Filing Dt:
|
03/22/2005
|
|
Publication #:
|
|
Pub Dt:
|
10/13/2005
| | | | |
|
Title:
|
Interlayer member used for producing multilayer wiring board and method of producing the same
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/12/2011
|
Application #:
|
11239744
|
Filing Dt:
|
09/30/2005
|
|
Publication #:
|
|
Pub Dt:
|
04/13/2006
| | | | |
|
Title:
|
STRUCTURE AND METHOD OF MAKING INTERCONNECT ELEMENT, AND MULTILAYER WIRING BOARD INCLUDING THE INTERCONNECT ELEMENT
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/16/2009
|
Application #:
|
11487747
|
Filing Dt:
|
07/17/2006
|
|
Publication #:
|
|
Pub Dt:
|
11/16/2006
| | | | |
|
Title:
|
MANUFACTURING METHOD FOR WIRING CIRCUIT SUBSTRATE
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
11585287
|
Filing Dt:
|
10/23/2006
|
|
Publication #:
|
|
Pub Dt:
|
09/27/2007
| | | | |
|
Title:
|
Apparatus and method for distributing a liquid onto a surface of an item
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/17/2009
|
Application #:
|
11657286
|
Filing Dt:
|
01/24/2007
|
|
Publication #:
|
|
Pub Dt:
|
05/31/2007
| | | | |
|
Title:
|
MULTILAYER WIRING BOARD FOR AN ELECTRONIC DEVICE
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
11662024
|
Filing Dt:
|
06/25/2008
|
|
Publication #:
|
|
Pub Dt:
|
10/30/2008
| | | | |
|
Title:
|
Member for Interconnecting Wiring Films and Method for Producing the Same
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/14/2012
|
Application #:
|
11720711
|
Filing Dt:
|
08/01/2007
|
|
Publication #:
|
|
Pub Dt:
|
05/15/2008
| | | | |
|
Title:
|
METHOD FOR MANUFACTURING MULTILAYER WIRING BOARD
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/25/2010
|
Application #:
|
11784810
|
Filing Dt:
|
04/10/2007
|
|
Publication #:
|
|
Pub Dt:
|
09/13/2007
| | | | |
|
Title:
|
METHODS OF MAKING MICROELECTRONIC ASSEMBLIES
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
11805300
|
Filing Dt:
|
05/23/2007
|
|
Publication #:
|
|
Pub Dt:
|
06/12/2008
| | | | |
|
Title:
|
Structure and method of making interconnect element having metal traces embedded in surface of dielectric
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
11811066
|
Filing Dt:
|
06/08/2007
|
|
Publication #:
|
|
Pub Dt:
|
06/05/2008
| | | | |
|
Title:
|
Method of manufacturing a multi-layer wiring board using a metal member having a rough surface
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
11897200
|
Filing Dt:
|
08/29/2007
|
|
Publication #:
|
|
Pub Dt:
|
07/17/2008
| | | | |
|
Title:
|
Structure and method of making interconnect element having metal traces embedded in surface of dielectric
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
12008546
|
Filing Dt:
|
01/11/2008
|
|
Publication #:
|
|
Pub Dt:
|
12/04/2008
| | | | |
|
Title:
|
Multilayer wiring board for an electronic device
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
12228537
|
Filing Dt:
|
08/13/2008
|
|
Publication #:
|
|
Pub Dt:
|
03/19/2009
| | | | |
|
Title:
|
Multilayer substrate with interconnection vias and method of manufacturing the same
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/21/2012
|
Application #:
|
12290873
|
Filing Dt:
|
11/04/2008
|
|
Publication #:
|
|
Pub Dt:
|
05/14/2009
| | | | |
|
Title:
|
BUMP STRUCTURE FORMED FROM USING REMOVABLE MANDREL
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/30/2012
|
Application #:
|
12317707
|
Filing Dt:
|
12/23/2008
|
|
Publication #:
|
|
Pub Dt:
|
07/30/2009
| | | | |
|
Title:
|
INTERCONNECTION ELEMENT FOR ELECTRIC CIRCUITS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/11/2013
|
Application #:
|
12459864
|
Filing Dt:
|
07/08/2009
|
|
Publication #:
|
|
Pub Dt:
|
01/14/2010
| | | | |
|
Title:
|
MICROELECTRONIC INTERCONNECT ELEMENT WITH DECREASED CONDUCTOR SPACING
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
12462208
|
Filing Dt:
|
07/30/2009
|
|
Publication #:
|
|
Pub Dt:
|
02/25/2010
| | | | |
|
Title:
|
Microelectronic substrate or element having conductive pads and metal posts joined thereto using bond layer
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
12519950
|
Filing Dt:
|
11/20/2009
|
|
Publication #:
|
|
Pub Dt:
|
03/25/2010
| | | | |
|
Title:
|
CHIP CAPACITOR EMBEDDED PWB
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
12658926
|
Filing Dt:
|
02/16/2010
|
|
Publication #:
|
|
Pub Dt:
|
09/30/2010
| | | | |
|
Title:
|
Wiring circuit board, manufacturing method for the wiring circuit board, and circuit module
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/27/2014
|
Application #:
|
12941511
|
Filing Dt:
|
11/08/2010
|
|
Publication #:
|
|
Pub Dt:
|
03/10/2011
| | | | |
|
Title:
|
STRUCTURE AND METHOD OF MAKING INTERCONNECT ELEMENT HAVING METAL TRACES EMBEDDED IN SURFACE OF DIELECTRIC
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/14/2014
|
Application #:
|
13085126
|
Filing Dt:
|
04/12/2011
|
|
Publication #:
|
|
Pub Dt:
|
10/20/2011
| | | | |
|
Title:
|
STRUCTURE AND METHOD OF MAKING INTERCONNECT ELEMENT, AND MULTILAYER WIRING BOARD INCLUDING THE INTERCONNECT ELEMENT
|
|
