Patent Assignment Details
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Reel/Frame: | 006058/0385 | |
| Pages: | 3 |
| | Recorded: | 03/06/1992 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/05/1994
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Application #:
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07847368
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Filing Dt:
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03/06/1992
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Title:
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METHOD OFSELECTIVELY ETCHING SILICON DIOXIDE DIELECTRIC LAYERS ON SEMICONDUCTOR WAFERS
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Assignee
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2805 E. COLUMBIA ROAD |
A CORPORATION OF DELAWARE |
BOISE, ID 83706, IDAHO 83706 |
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Correspondence name and address
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WELLS, ST. JOHN & ROBERTS, P.S.
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W. 601 MAIN AVENUE, STE. 815
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SPOKANE, WA 99201-0679
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