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Patent Assignment Details
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Reel/Frame:019449/0385   Pages: 3
Recorded: 06/18/2007
Conveyance: CORRECTIVE ASSIGNMENT TO CORRECT THE THIRD INVENTOR NAME, PREVIOUSLY RECORDED AT REEL 019030 FRAME 0001.
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
11712504
Filing Dt:
03/01/2007
Publication #:
Pub Dt:
02/07/2008
Title:
Method of fabricating a semiconductor device having expanded contact holes with contact spacers therein and semiconductor device fabricated thereby
Assignors
1
Exec Dt:
02/20/2007
2
Exec Dt:
02/20/2007
3
Exec Dt:
02/22/2007
4
Exec Dt:
02/20/2007
Assignee
1
416 MAETAN-DONG, YEONGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Correspondence name and address
EUGENE M. LEE
LEE & MORSE, PC
3141 FAIRVIEW PARK DRIVE
SUITE 500
FALLS CHURCH, VA 22042

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