Patent Assignment Details
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| Reel/Frame: | 053506/0385 | |
| Pages: | 16 |
| | Recorded: | 08/15/2020 | | |
| Attorney Dkt #: | TSLC-SHIN-ETSU 2019-002/U |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/16/2022
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Application #:
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16987478
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Filing Dt:
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08/07/2020
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Publication #:
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Pub Dt:
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03/04/2021
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Title:
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Method For Fabricating (LED) Dice Using Laser Lift-Off From A Substrate To A Receiving Plate
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Assignees
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| 1F, NO. 11, KE JUNG RD., CHU-NAN SITE |
| HSINCHU SCIENCE PARK |
| CHU-NAN 350, MIAO-LI COUNTY, TAIWAN 350 |
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| ASAHI SEIMEI OTEMACHI BLDG. 6-1 |
| OHTEMACHI 2-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 100-0004 |
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Correspondence name and address
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STEPHEN A. GRATTON
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2764 SOUTH BRAUN WAY
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LAKEWOOD, CO 80228
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