Patent Assignment Details
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| Reel/Frame: | 034036/0388 | |
| Pages: | 3 |
| | Recorded: | 10/27/2014 | | |
| Attorney Dkt #: | CUL-037C1/7313713001 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/12/2016
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Application #:
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14523433
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Filing Dt:
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10/24/2014
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Publication #:
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Pub Dt:
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04/23/2015
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Title:
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WAFER-LEVEL FLIP CHIP DEVICE PACKAGES AND RELATED METHODS
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Assignee
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| UNIT 1A-3751 NORTH FRASER WAY |
| BURNABY, BRITISH COLUMBIA, CANADA V5J 5G4 |
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Correspondence name and address
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BINGHAM MCCUTCHEN LLP
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2020 K STREET NW
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WASHINGTON, DC 20006
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06/22/2024 01:40 PM
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