Patent Assignment Details
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| Reel/Frame: | 039495/0388 | |
| Pages: | 4 |
| | Recorded: | 08/22/2016 | | |
| Attorney Dkt #: | 252011-6070 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/19/2020
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Application #:
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15240422
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Filing Dt:
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08/18/2016
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Publication #:
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Pub Dt:
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02/22/2018
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Title:
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METHOD FOR FORMING A PACKAGE STRUCTURE INCLUDING A PACKAGE LAYER SURROUNDING FIRST CONNECTORS BESIDE AN INTEGRATED CIRCUIT DIE AND SECOND CONNECTORS BELOW THE INTEGRATED CIRCUIT DIE
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Assignee
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| NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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Correspondence name and address
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MCCLURE, QUALEY & RODACK, LLP
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3100 INTERSTATE NORTH CIRCLE
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SUITE 150
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ATLANTA, GA 30339
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