Patent Assignment Details
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Reel/Frame: | 019618/0389 | |
| Pages: | 3 |
| | Recorded: | 07/27/2007 | | |
Attorney Dkt #: | NGC-00118 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11782503
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Filing Dt:
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07/24/2007
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Publication #:
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Pub Dt:
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01/29/2009
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Title:
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Method for Backside Metallization for Semiconductor Substrate
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Assignee
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1840 CENTURY PARK EAST |
LOS ANGELES, CALIFORNIA 90067 |
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Correspondence name and address
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JOHN A. MILLER
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42690 WOODWARD AVE., STE. 200
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BLOOMFIELD HILLS, MI 48304
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