|
Total properties:
15
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/27/2001
|
Application #:
|
09266232
|
Filing Dt:
|
03/10/1999
|
|
Title:
|
FLIP CHIP WITH INTEGRATED FLUX AND UNDERFILL
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/20/2001
|
Application #:
|
09282729
|
Filing Dt:
|
03/31/1999
|
|
Title:
|
PROCESS FOR SILVER PLATING IN PRINTED CIRCUIT BOARD MANUFACTURE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/08/2001
|
Application #:
|
09395558
|
Filing Dt:
|
09/14/1999
|
|
Title:
|
FLIP CHIP HAVING INTEGRAL MASK AND UNDERFILL PROVIDING TWO-STAGE BUMP FORMATION
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/23/2007
|
Application #:
|
10458925
|
Filing Dt:
|
06/11/2003
|
|
Publication #:
|
|
Pub Dt:
|
12/16/2004
| | | | |
|
Title:
|
THERMOPLASTIC FLUXING UNDERFILL COMPOSITION AND METHOD
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/06/2007
|
Application #:
|
10722288
|
Filing Dt:
|
11/25/2003
|
|
Publication #:
|
|
Pub Dt:
|
10/14/2004
| | | | |
|
Title:
|
THERMAL INTERFACE MATERIAL AND SOLDER PREFORMS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/22/2006
|
Application #:
|
10899679
|
Filing Dt:
|
07/26/2004
|
|
Publication #:
|
|
Pub Dt:
|
12/30/2004
| | | | |
|
Title:
|
COATED STENCIL WITH REDUCED SURFACE TENSION
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/02/2010
|
Application #:
|
12191710
|
Filing Dt:
|
08/14/2008
|
|
Publication #:
|
|
Pub Dt:
|
12/04/2008
| | | | |
|
Title:
|
COATED SOLDER METAL PARTICLES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/06/2010
|
Application #:
|
12201654
|
Filing Dt:
|
08/29/2008
|
|
Publication #:
|
|
Pub Dt:
|
03/26/2009
| | | | |
|
Title:
|
ELECTROFORMED STENCILS FOR SOLAR CELL FRONT SIDE METALLIZATION
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
12497065
|
Filing Dt:
|
07/02/2009
|
|
Publication #:
|
|
Pub Dt:
|
06/10/2010
| | | | |
|
Title:
|
FLUX FORMULATIONS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/09/2014
|
Application #:
|
13471203
|
Filing Dt:
|
05/14/2012
|
|
Title:
|
PROCESS FOR SILVER PLATING IN PRINTED CIRCUIT BOARD MANUFACTURE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/07/2014
|
Application #:
|
13655159
|
Filing Dt:
|
10/18/2012
|
|
Title:
|
PROCESS FOR SILVER PLATING IN PRINTED CIRCUIT BOARD MANUFACTURE
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
14095559
|
Filing Dt:
|
12/03/2013
|
|
Publication #:
|
|
Pub Dt:
|
07/03/2014
| | | | |
|
Title:
|
SOLVENT SYSTEMS FOR METALS AND INKS
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
14236432
|
Filing Dt:
|
03/21/2014
|
|
Publication #:
|
|
Pub Dt:
|
08/07/2014
| | | | |
|
Title:
|
HIGH IMPACT TOUGHNESS SOLDER ALLOY
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
14236480
|
Filing Dt:
|
03/21/2014
|
|
Publication #:
|
|
Pub Dt:
|
07/17/2014
| | | | |
|
Title:
|
SOLDER COMPOSITIONS
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
14434470
|
Filing Dt:
|
04/09/2015
|
|
Publication #:
|
|
Pub Dt:
|
09/24/2015
| | | | |
|
Title:
|
LEAD-FREE AND ANTIMONY-FREE TIN SOLDER RELIABLE AT HIGH TEMPERATURES
|
|
