Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 054776/0390 | |
| Pages: | 14 |
| | Recorded: | 12/30/2020 | | |
| Attorney Dkt #: | AOS-P146 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/30/2022
|
Application #:
|
17137811
|
Filing Dt:
|
12/30/2020
|
|
Publication #:
|
|
Pub Dt:
|
06/30/2022
| | | | |
|
Title:
|
METHOD FOR SEMI-WAFER LEVEL PACKAGING
|
|
|
Assignee
|
|
|
|
|
| 100 KING STREET WEST, SUITE # 6000 |
| TORONTO, CANADA ONTARIO M5X 1E2 |
|
|
Correspondence name and address
|
| |
CHEN-CHI LIN
|
| |
1119 QUAIL CREEK CIR
|
| |
SAN JOSE, CA 95120-4148
|
Search Results as of:
06/23/2024 03:51 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
