Patent Assignment Details
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| Reel/Frame: | 012079/0392 | |
| Pages: | 3 |
| | Recorded: | 08/10/2001 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/15/2004
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Application #:
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09927723
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Filing Dt:
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08/10/2001
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Publication #:
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Pub Dt:
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02/13/2003
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Title:
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METHOD OF FABRICATING INTER-LAYER SOLID CONDUCTIVE RODS
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Assignee
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| NO. 66-6, HOU PI TSO, 9 LIN, KENG KOU VILLAGE |
| LU-CHU COUNTRY, TAOYUAN HSIEN, TAIWAN R.O.C |
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Correspondence name and address
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J.C. PATENTS, INC.
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JIAWEI HUANG
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1340 REYNOLDS AVENUE, SUITE 114
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IRVINE, CALIFORNIA 92614
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