Patent Assignment Details
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Reel/Frame: | 036110/0392 | |
| Pages: | 3 |
| | Recorded: | 07/16/2015 | | |
Attorney Dkt #: | 35008-00004 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/20/2016
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Application #:
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14800990
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Filing Dt:
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07/16/2015
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Title:
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FAN-OUT WAFER LEVEL PACKAGE AND MANUFACTURING METHOD THEREOF
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Assignee
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16, BAEKSEOKGONGDAN 7-RO, SEOBUK-GU |
CHEONAN-SI,CHUNGCHEONGNAM-DO, KOREA, REPUBLIC OF 330-220 |
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Correspondence name and address
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NOVAK DRUCE CONNOLLY BOVE + QUIGG LLP
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1875 EYE ST NW
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SUITE 1100
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WASHINGTON, DC 20006-5409
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