Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 013506/0393 | |
| Pages: | 2 |
| | Recorded: | 11/20/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
6
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Patent #:
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Issue Dt:
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03/16/1999
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Application #:
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08868923
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Filing Dt:
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06/04/1997
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Title:
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LEADFRAME FOR INTERGRATED CIRCUIT PACKAGE AND METHOD OF MANUFACTURING THE SAME
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Patent #:
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Issue Dt:
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03/30/1999
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Application #:
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08870906
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Filing Dt:
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06/06/1997
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Title:
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LEADFRAME FOR INTEGRATED CIRCUIT PACKAGE
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Patent #:
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Issue Dt:
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11/30/1999
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Application #:
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09083444
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Filing Dt:
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05/22/1998
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Title:
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LEADFRAME FOR INTEGRATED CIRCUIT PACKAGE AND METHOD OF MANUFACTURING THE SAME
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Patent #:
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Issue Dt:
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06/20/2000
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Application #:
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09249881
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Filing Dt:
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02/16/1999
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Title:
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LEAD FRAME STRUCTURE FOR PREVENTING THE WARPING OF SEMICONDUCTOR PACKAGE BODY
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Patent #:
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Issue Dt:
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07/17/2001
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Application #:
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09250985
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Filing Dt:
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02/16/1999
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Title:
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LEAD FRAME WITH HEAT SLUG
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Patent #:
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Issue Dt:
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04/10/2001
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Application #:
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09313171
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Filing Dt:
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05/17/1999
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Title:
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DUAL LEADFRAME PACKAGE
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Assignee
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| 1FL., NO. 172, SEC. 2, NANJING E. RD. |
| JUNGSHAN CHIU, TAIPEI 104, TAIWAN R.O.C. |
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Correspondence name and address
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J. C. PATENTS, INC.
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JIAWEI HUANG
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4 VENTURE, SUITE 250
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IRVINE, CA 92618
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