Patent Assignment Details
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| Reel/Frame: | 019377/0393 | |
| Pages: | 2 |
| | Recorded: | 05/10/2007 | | |
| Attorney Dkt #: | 68228(71987) |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11801625
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Filing Dt:
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05/10/2007
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Publication #:
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Pub Dt:
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01/24/2008
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Title:
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Heat dissipating semiconductor package and heat dissipating structure thereof
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Assignee
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| NO. 123, SEC. 3, DA FONG RD., TANTZU |
| TAICHUNG, TAIWAN ROC |
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Correspondence name and address
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PETER F. CORLESS
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EDWARD ANGELL PALMER & DODGE LLP
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P.O. BOX 55874
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BOSTON, MA 02205
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