Patent Assignment Details
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| Reel/Frame: | 054349/0393 | |
| Pages: | 5 |
| | Recorded: | 11/12/2020 | | |
| Attorney Dkt #: | H-303 (FP1090054) |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/14/2022
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Application #:
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17096190
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Filing Dt:
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11/12/2020
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Publication #:
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Pub Dt:
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02/03/2022
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Title:
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BUMP STRUCTURE OF THE SEMICONDUCTOR PACKAGE
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Assignee
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| NO.10, DATONG RD. |
| HUKOU TOWNSHIP, HSINCHU COUNTY, TAIWAN 30352 |
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Correspondence name and address
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PATENTTM.US JAMES H. WALTERS
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205 SE SPOKANE ST STE 300
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PORTLAND, OR 97202-6487
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