Patent Assignment Details
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| Reel/Frame: | 012555/0394 | |
| Pages: | 3 |
| | Recorded: | 02/01/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/03/2004
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Application #:
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10062218
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Filing Dt:
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02/01/2002
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Publication #:
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Pub Dt:
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08/07/2003
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Title:
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METHOD AND SYSTEM FOR EXPOSED DIE MOLDING FOR INTEGRATED CIRCUIT PACKAGING
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Assignee
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| 1310 ELECTRONICS DRIVE |
| CARROLLTON, TEXAS 75006 |
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Correspondence name and address
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STMICROELECTRONICS, INC.
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LISA K. JORGENSON, ESQ.
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1310 ELECTRONICS DRIVE MS 2346
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CARROLLTON, TEXAS 75006
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