Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 050706/0395 | |
| Pages: | 6 |
| | Recorded: | 10/14/2019 | | |
| Attorney Dkt #: | APPM22770D1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16549301
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Filing Dt:
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08/23/2019
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Publication #:
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Pub Dt:
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12/12/2019
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Title:
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Method for lower thermal budget multiple cures in semiconductor packaging
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Assignee
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| 860 AVIATION PARKWAY |
| SUITE 900 |
| MORRISVILLE, NORTH CAROLINA 27560 |
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Correspondence name and address
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MOSER TABOADA/ALAN TABOADA
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1030 BROAD STREET
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SUITE 203
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SHREWSBURY, NJ 07702
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09/21/2024 06:17 AM
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