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Patent Assignment Details
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Reel/Frame:023866/0397   Pages: 6
Recorded: 01/28/2010
Attorney Dkt #:MLID-11-1001
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 4
1
Patent #:
NONE
Issue Dt:
Application #:
11890997
Filing Dt:
08/07/2007
Publication #:
Pub Dt:
02/12/2009
Title:
Electroplating aqueous solution and method of making and using same
2
Patent #:
Issue Dt:
03/15/2011
Application #:
11906882
Filing Dt:
10/03/2007
Publication #:
Pub Dt:
04/09/2009
Title:
SUBSTRATE HOLDER AND ELECTROPLATING SYSTEM
3
Patent #:
NONE
Issue Dt:
Application #:
12011259
Filing Dt:
01/25/2008
Publication #:
Pub Dt:
07/30/2009
Title:
Methods of fabricating solar-cell structures and resulting solar-cell structures
4
Patent #:
NONE
Issue Dt:
Application #:
12080680
Filing Dt:
04/04/2008
Publication #:
Pub Dt:
10/08/2009
Title:
Methods for electroplating copper
Assignor
1
Exec Dt:
01/27/2010
Assignee
1
8248 RANDOLPH ROAD NE
MOSES LAKE, WASHINGTON 98837
Correspondence name and address
TRICIA WALKER
701 5TH AV
#4800
SEATTLE, WA 98104

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