Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 027960/0397 | |
| Pages: | 11 |
| | Recorded: | 03/30/2012 | | |
| Conveyance: | RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS). |
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Total properties:
5
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Patent #:
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Issue Dt:
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04/06/1993
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Application #:
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07767171
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Filing Dt:
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09/27/1991
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Title:
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EXPOSED DIE-ATTACH HEATSINK PACKAGE
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Patent #:
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Issue Dt:
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12/07/1993
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Application #:
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07939215
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Filing Dt:
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09/02/1992
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Title:
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DETAPING MACHINE FOR REMOVAL OF INTEGRATED CIRCUIT DEVICES FROM SEALED POCKET TAPE
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Patent #:
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Issue Dt:
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07/16/1996
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Application #:
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08486405
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Filing Dt:
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06/05/1995
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Title:
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INTEGRATED CIRCUIT TEST JIG
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Patent #:
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Issue Dt:
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10/29/1996
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Application #:
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08504944
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Filing Dt:
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07/20/1995
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Title:
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SPRING PROBE BGA (BALL GRID ARRAY) CONTACTOR WITH DEVICE STOP AND METHOD THEREFOR
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Patent #:
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Issue Dt:
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12/23/1997
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Application #:
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08677150
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Filing Dt:
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07/09/1996
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Title:
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UNIVERSAL QFP TRAY TRANSFER METHOD
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Assignee
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| HIGH TECH CAMPUS 60 |
| EINDHOVEN, NETHERLANDS 5656 AG |
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Correspondence name and address
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DAVID L. SCHAEFFER
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411 EAST PLUMERIA DRIVE, MS41
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NXP SEMICONDUCTORS, IP&L
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SAN JOSE, CA 95134
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