Patent Assignment Details
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| Reel/Frame: | 031140/0398 | |
| Pages: | 2 |
| | Recorded: | 09/05/2013 | | |
| Attorney Dkt #: | TAI-333 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/03/2015
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Application #:
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14018518
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Filing Dt:
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09/05/2013
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Publication #:
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Pub Dt:
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03/13/2014
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Title:
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METHOD FOR THINNING, METALIZING, AND DICING A SEMICONDUCTOR WAFER, AND SEMICONDUCTOR DEVICE MADE USING THE METHOD
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Assignee
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| 2-4-8 SHINYOKOHAMA, KOUHOKU-KU |
| YOKOHAMA, JAPAN 222-8575 |
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Correspondence name and address
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RABIN & BERDO, P.C.
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1101 14TH ST., N.W., SUITE 500
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WASHINGTON, DC 20005
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