Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 043427/0398 | |
| Pages: | 2 |
| | Recorded: | 08/28/2017 | | |
| Attorney Dkt #: | IVS-105C5/INVEP208USF |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
15688788
|
Filing Dt:
|
08/28/2017
|
|
Publication #:
|
|
Pub Dt:
|
12/14/2017
| | | | |
|
Title:
|
METHOD OF FABRICATION OF Al/GE BONDING IN A WAFER PACKAGING ENVIRONMENT AND A PRODUCT PRODUCED THEREFROM
|
|
|
Assignee
|
|
|
|
|
| 2900 GORDON AVENUE, SUITE 203 |
| SANTA CLARA, CALIFORNIA 95051 |
|
|
Correspondence name and address
|
| |
TUROCY & WATSON, LLP (INVENSENSE, INC.)
|
| |
KEY TOWER
|
| |
127 PUBLIC SQUARE, 57TH FL.
|
| |
CLEVELAND, OH 44114
|
Search Results as of:
09/25/2024 02:17 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
