Patent Assignment Details
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Reel/Frame: | 023472/0399 | |
| Pages: | 5 |
| | Recorded: | 11/04/2009 | | |
Attorney Dkt #: | 0008.0018 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12612616
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Filing Dt:
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11/04/2009
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Publication #:
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Pub Dt:
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11/04/2010
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Title:
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LOW THERMAL RESISTANCE AND ROBUST CHIP-SCALE-PACKAGE (CSP), STRUCTURE AND METHOD
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Assignee
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1001 MURPHY RANCH ROAD |
MILPITAS, CALIFORNIA 95035 |
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Correspondence name and address
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MH2 TECHNOLOGY LAW GROUP, LLP
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1951 KIDWELL DRIVE
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SUITE 550
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TYSONS CORNER, VA 22182
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