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Patent Assignment Details
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Reel/Frame:006493/0400   Pages: 2
Recorded: 03/24/1993
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST.
Total properties: 1
1
Patent #:
Issue Dt:
08/16/1994
Application #:
08036564
Filing Dt:
03/24/1993
Title:
MULTI-LAYERED INTEGRATED CIRCUIT PACKAGE WITH IMPROVED HIGH FREQUENCY PERFORMANCE
Assignor
1
Exec Dt:
03/23/1993
Assignee
1
ONE MADISON INDUSTRIAL PARK
HUNTSVILLE, ALABAMA 35807
Correspondence name and address
ROBERT C. COLWELL
TOWNSEND AND TOWSEND KHOURIE AND CREW
20TH FLR., STEUART STREET TOWER
ONE MARKET PLAZA
SAN FRANCISCO, CA 94105-1492

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