Patent Assignment Details
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| Reel/Frame: | 011126/0400 | |
| Pages: | 2 |
| | Recorded: | 08/22/2000 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/13/2002
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Application #:
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09643646
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Filing Dt:
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08/22/2000
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Title:
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Method of fabricating flip chip ic packages with heat spreaders in strip format
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Assignee
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| P.O. BOX 655474 M/S 3999 |
| DALLAS, TEXAS 75265 |
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Correspondence name and address
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NOVARRO IP LAW GROUP, P.C.
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GARY C. HONEYCUT
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801 E. CAMPBELL RD.
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SUITE 655
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RICHARDSON, TX 75081
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