Patent Assignment Details
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Reel/Frame: | 023094/0400 | |
| Pages: | 3 |
| | Recorded: | 08/13/2009 | | |
Attorney Dkt #: | 70452.7 (M-16609-1C US) |
Conveyance: | CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/23/1997
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Application #:
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08471739
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Filing Dt:
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06/06/1995
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Title:
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METHOD FOR PACKAGING AN INTEGRATED CIRCUIT USING A RECONSTRUCTED PACKAGE
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Assignee
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31398 HUNTWOOD AVENUE |
HAYWARD, CALIFORNIA 94544 |
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Correspondence name and address
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HAYNES AND BOONE, LLP IP SECTION
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2323 VICTORY AVENUE
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SUITE 700
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DALLAS, TX 75219
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