Total properties:
84
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Patent #:
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|
Issue Dt:
|
12/09/2003
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Application #:
|
09640534
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Filing Dt:
|
08/17/2000
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Title:
|
FLIP CHIP MOLDED/EXPOSED DIE PROCESS AND PACKAGE STRUCTURE
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Patent #:
|
|
Issue Dt:
|
07/22/2003
|
Application #:
|
09658890
|
Filing Dt:
|
09/11/2000
|
Title:
|
GROUND LAND FOR SINGULATED BALL GRID ARRAY
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|
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Patent #:
|
|
Issue Dt:
|
04/08/2003
|
Application #:
|
09706220
|
Filing Dt:
|
11/06/2000
|
Title:
|
SINGLE UNIT AUTOMATED ASSEMBLY OF FLEX ENHANCED BALL GRID ARRAY PACKAGES
|
|
|
Patent #:
|
|
Issue Dt:
|
06/24/2003
|
Application #:
|
09759904
|
Filing Dt:
|
01/16/2001
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Publication #:
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|
Pub Dt:
|
07/18/2002
| | | | |
Title:
|
PROCESS AND SUPPORT CARRIER FOR FLEXIBLE SUBSTRATES
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|
|
Patent #:
|
|
Issue Dt:
|
07/01/2003
|
Application #:
|
09828677
|
Filing Dt:
|
04/09/2001
|
Publication #:
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|
Pub Dt:
|
10/10/2002
| | | | |
Title:
|
METHOD AND APPARATUS FOR ESTABLISHING QUICK AND RELIABLE CONNECTION BETWEEN A SEMICONDUCTOR DEVICE HANDLER PLATE AND A SEMICONDUCTOR DEVICE TEST HEAD PLATE
|
|
|
Patent #:
|
|
Issue Dt:
|
09/02/2003
|
Application #:
|
09919763
|
Filing Dt:
|
07/31/2001
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Publication #:
|
|
Pub Dt:
|
02/06/2003
| | | | |
Title:
|
PLASTIC BALL GRID ARRAY PACKAGE WITH INTEGRAL HEATSINK
|
|
|
Patent #:
|
|
Issue Dt:
|
07/29/2003
|
Application #:
|
09961555
|
Filing Dt:
|
09/24/2001
|
Publication #:
|
|
Pub Dt:
|
03/27/2003
| | | | |
Title:
|
PBGA SUBSTRATE FOR ANCHORING HEAT SINK
|
|
|
Patent #:
|
|
Issue Dt:
|
09/09/2003
|
Application #:
|
10043603
|
Filing Dt:
|
01/14/2002
|
Publication #:
|
|
Pub Dt:
|
05/16/2002
| | | | |
Title:
|
MOLDED STIFFENER FOR FLEXIBLE CIRCUIT MOLDING
|
|
|
Patent #:
|
|
Issue Dt:
|
05/18/2004
|
Application #:
|
10055094
|
Filing Dt:
|
01/23/2002
|
Publication #:
|
|
Pub Dt:
|
07/24/2003
| | | | |
Title:
|
HEAT SPREADER ANCHORING & GROUNDING METHOD & THERMALLY ENHANCED PBGA PACKAGE USING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
10/07/2003
|
Application #:
|
10083993
|
Filing Dt:
|
02/26/2002
|
Publication #:
|
|
Pub Dt:
|
08/28/2003
| | | | |
Title:
|
GROUND PLANE FOR EXPOSED PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
06/15/2004
|
Application #:
|
10099284
|
Filing Dt:
|
03/15/2002
|
Publication #:
|
|
Pub Dt:
|
07/18/2002
| | | | |
Title:
|
HEAT SPREADER HOLE PIN 1 IDENTIFIER
|
|
|
Patent #:
|
|
Issue Dt:
|
03/16/2004
|
Application #:
|
10119920
|
Filing Dt:
|
04/10/2002
|
Publication #:
|
|
Pub Dt:
|
10/23/2003
| | | | |
Title:
|
HEAT SPREADER INTERCONNECT METHODOLOGY FOR THERMALLY ENHANCED PBGA PACKAGES
|
|
|
Patent #:
|
|
Issue Dt:
|
09/14/2004
|
Application #:
|
10140573
|
Filing Dt:
|
05/08/2002
|
Publication #:
|
|
Pub Dt:
|
09/12/2002
| | | | |
Title:
|
TESTING OF BGA AND OTHER CSP PACKAGES USING PROBING TECHNIQUES
|
|
|
Patent #:
|
|
Issue Dt:
|
05/25/2004
|
Application #:
|
10151977
|
Filing Dt:
|
05/21/2002
|
Publication #:
|
|
Pub Dt:
|
11/27/2003
| | | | |
Title:
|
A METHOD OF FORMING A SMALL PITCH TORCH BUMP FOR MOUNTING HIGH-PERFORMANCE FLIP-FLOP DEVICES
|
|
|
Patent #:
|
|
Issue Dt:
|
08/10/2004
|
Application #:
|
10224151
|
Filing Dt:
|
08/20/2002
|
Publication #:
|
|
Pub Dt:
|
02/26/2004
| | | | |
Title:
|
TEST COUPON PATTERN DESIGN TO CONTROL MULTILAYER SAW SINGULATED PLASTIC BALL GRID ARRAY SUBSTRATE MIS-REGISTRATION
|
|
|
Patent #:
|
|
Issue Dt:
|
12/28/2004
|
Application #:
|
10236579
|
Filing Dt:
|
09/06/2002
|
Publication #:
|
|
Pub Dt:
|
02/06/2003
| | | | |
Title:
|
PBGA SINGULATED SUBSTRATE FOR MODEL MELAMINE CLEANING
|
|
|
Patent #:
|
|
Issue Dt:
|
02/03/2004
|
Application #:
|
10236650
|
Filing Dt:
|
09/06/2002
|
Publication #:
|
|
Pub Dt:
|
01/16/2003
| | | | |
Title:
|
METHOD OF TRIMMING AND SINGULATING LEADED SEMICONDUCTOR PACKAGES
|
|
|
Patent #:
|
|
Issue Dt:
|
02/15/2005
|
Application #:
|
10251231
|
Filing Dt:
|
09/19/2002
|
Publication #:
|
|
Pub Dt:
|
03/25/2004
| | | | |
Title:
|
INTEGRATED CIRCUIT PACKAGE AND MANUFACTURING METHOD THEREFOR
|
|
|
Patent #:
|
|
Issue Dt:
|
01/11/2005
|
Application #:
|
10256407
|
Filing Dt:
|
09/27/2002
|
Publication #:
|
|
Pub Dt:
|
04/01/2004
| | | | |
Title:
|
LEADFRAME FOR DIE STACKING APPLICATIONS AND RELATED DIE STACKING CONCEPTS
|
|
|
Patent #:
|
|
Issue Dt:
|
10/12/2004
|
Application #:
|
10279900
|
Filing Dt:
|
10/24/2002
|
Publication #:
|
|
Pub Dt:
|
04/29/2004
| | | | |
Title:
|
COST EFFECTIVE SUBSTRATE FABRICATION FOR FLIP-CHIP PACKAGES
|
|
|
Patent #:
|
|
Issue Dt:
|
11/30/2004
|
Application #:
|
10315533
|
Filing Dt:
|
12/10/2002
|
Publication #:
|
|
Pub Dt:
|
06/10/2004
| | | | |
Title:
|
MOLD CAP ANCHORING METHOD FOR MOLDED FLEX BGA PACKAGES
|
|
|
Patent #:
|
|
Issue Dt:
|
12/07/2004
|
Application #:
|
10323447
|
Filing Dt:
|
12/19/2002
|
Publication #:
|
|
Pub Dt:
|
05/08/2003
| | | | |
Title:
|
ENHANCED BGA GROUNDED HEATSINK
|
|
|
Patent #:
|
|
Issue Dt:
|
06/01/2004
|
Application #:
|
10339158
|
Filing Dt:
|
01/09/2003
|
Publication #:
|
|
Pub Dt:
|
07/31/2003
| | | | |
Title:
|
SUPER THIN/SUPER THERMAL BALL GRID ARRAY PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
09/30/2003
|
Application #:
|
10359407
|
Filing Dt:
|
02/06/2003
|
Title:
|
THERMALLY ENHANCED STACKED DIE PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
07/06/2004
|
Application #:
|
10371515
|
Filing Dt:
|
02/20/2003
|
Publication #:
|
|
Pub Dt:
|
08/14/2003
| | | | |
Title:
|
SINGLE UNIT AUTOMATED ASSEMBLY OF FLEX ENHANCED BALL GRID ARRAY PACKAGES
|
|
|
Patent #:
|
|
Issue Dt:
|
08/10/2004
|
Application #:
|
10434256
|
Filing Dt:
|
05/07/2003
|
Publication #:
|
|
Pub Dt:
|
04/22/2004
| | | | |
Title:
|
HEAT SPREADERS, HEAT SPREADER PACKAGES, AND FABRICATION METHODS FOR USE WITH FLIP CHIP SEMICONDUCTOR DEVICES
|
|
|
Patent #:
|
|
Issue Dt:
|
06/20/2006
|
Application #:
|
10444849
|
Filing Dt:
|
05/23/2003
|
Publication #:
|
|
Pub Dt:
|
04/01/2004
| | | | |
Title:
|
INTEGRATED CIRCUIT LEADFRAME WITH GROUND PLANE
|
|
|
Patent #:
|
|
Issue Dt:
|
11/14/2006
|
Application #:
|
10446275
|
Filing Dt:
|
05/23/2003
|
Publication #:
|
|
Pub Dt:
|
04/01/2004
| | | | |
Title:
|
MOISTURE RESISTANT INTEGRATED CIRCUIT LEADFRAME PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
04/05/2005
|
Application #:
|
10462264
|
Filing Dt:
|
06/16/2003
|
Publication #:
|
|
Pub Dt:
|
04/15/2004
| | | | |
Title:
|
GROUND PLANE FOR EXPOSED PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
11/04/2008
|
Application #:
|
10462288
|
Filing Dt:
|
06/16/2003
|
Publication #:
|
|
Pub Dt:
|
11/20/2003
| | | | |
Title:
|
SEMICONDUCTOR PACKAGE WITH HEAT SINK
|
|
|
Patent #:
|
|
Issue Dt:
|
12/21/2004
|
Application #:
|
10463007
|
Filing Dt:
|
06/16/2003
|
Publication #:
|
|
Pub Dt:
|
12/16/2004
| | | | |
Title:
|
SYSTEM FOR SEMICONDUCTOR PACKAGE WITH STACKED DIES
|
|
|
Patent #:
|
|
Issue Dt:
|
08/09/2005
|
Application #:
|
10606429
|
Filing Dt:
|
06/25/2003
|
Publication #:
|
|
Pub Dt:
|
12/30/2004
| | | | |
Title:
|
METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE FOR A DIE LARGER THAN A DIE PAD
|
|
|
Patent #:
|
|
Issue Dt:
|
03/01/2005
|
Application #:
|
10676736
|
Filing Dt:
|
09/30/2003
|
Publication #:
|
|
Pub Dt:
|
07/29/2004
| | | | |
Title:
|
STACKED SEMICONDUCTOR PACKAGES AND METHOD FOR THE FABRICATION THEREOF
|
|
|
Patent #:
|
|
Issue Dt:
|
06/13/2006
|
Application #:
|
10681572
|
Filing Dt:
|
10/08/2003
|
Publication #:
|
|
Pub Dt:
|
06/17/2004
| | | | |
Title:
|
SEMICONDUCTOR STACKED MULTI-PACKAGE MODULE HAVING INVERTED SECOND PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
06/06/2006
|
Application #:
|
10681735
|
Filing Dt:
|
10/08/2003
|
Publication #:
|
|
Pub Dt:
|
06/24/2004
| | | | |
Title:
|
SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING INVERTED LAND GRID ARRAY (LGA) PACKAGE STACKED OVER BALL GRID ARRAY (BGA) PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
02/22/2005
|
Application #:
|
10682273
|
Filing Dt:
|
10/08/2003
|
Title:
|
METHOD FOR FABRICATING SEMICONDUCTOR PACKAGES, AND LEADFRAME ASSEMBLIES FOR THE FABRICATION THEREOF
|
|
|
Patent #:
|
|
Issue Dt:
|
07/25/2006
|
Application #:
|
10693217
|
Filing Dt:
|
10/24/2003
|
Publication #:
|
|
Pub Dt:
|
05/06/2004
| | | | |
Title:
|
FLIP CHIP MOLDED/EXPOSED DIE PROCESS AND PACKAGE STRUCTURE
|
|
|
Patent #:
|
|
Issue Dt:
|
07/18/2006
|
Application #:
|
10745149
|
Filing Dt:
|
12/22/2003
|
Publication #:
|
|
Pub Dt:
|
07/15/2004
| | | | |
Title:
|
MULTI-PACKAGE CONVERSION KIT FOR A PICK AND PLACE HANDLER
|
|
|
Patent #:
|
|
Issue Dt:
|
11/16/2004
|
Application #:
|
10765644
|
Filing Dt:
|
01/26/2004
|
Publication #:
|
|
Pub Dt:
|
08/12/2004
| | | | |
Title:
|
HEAT SPREADER INTERCONNECT FOR THERMALLY ENHANCED PBGA PACKAGES
|
|
|
Patent #:
|
|
Issue Dt:
|
12/26/2006
|
Application #:
|
10766746
|
Filing Dt:
|
01/27/2004
|
Publication #:
|
|
Pub Dt:
|
07/28/2005
| | | | |
Title:
|
STRIP-FABRICATED FLIP CHIP IN PACKAGE AND FLIP CHIP IN SYSTEM HEAT SPREADER ASSEMBLIES AND FABRICATION METHODS THEREFOR
|
|
|
Patent #:
|
|
Issue Dt:
|
02/28/2006
|
Application #:
|
10773716
|
Filing Dt:
|
02/05/2004
|
Publication #:
|
|
Pub Dt:
|
08/11/2005
| | | | |
Title:
|
SEMICONDUCTOR PACKAGE WITH PASSIVE DEVICE INTEGRATION
|
|
|
Patent #:
|
|
Issue Dt:
|
04/05/2005
|
Application #:
|
10804732
|
Filing Dt:
|
03/18/2004
|
Publication #:
|
|
Pub Dt:
|
09/16/2004
| | | | |
Title:
|
HEAT SPREADER ANCHORING AND GROUNDING METHOD AND THERMALLY ENHANCED PBGA PACKAGE USING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
12/11/2007
|
Application #:
|
10825810
|
Filing Dt:
|
04/16/2004
|
Publication #:
|
|
Pub Dt:
|
10/28/2004
| | | | |
Title:
|
SYSTEM FOR FABRICATING AN INTEGRATED CIRCUIT PACKAGE ON A PRINTED CIRCUIT BOARD
|
|
|
Patent #:
|
|
Issue Dt:
|
04/17/2007
|
Application #:
|
10825910
|
Filing Dt:
|
04/16/2004
|
Publication #:
|
|
Pub Dt:
|
10/20/2005
| | | | |
Title:
|
THERMALLY ENHANCED STACKED DIE PACKAGE AND FABRICATION METHOD
|
|
|
Patent #:
|
|
Issue Dt:
|
02/05/2008
|
Application #:
|
10836916
|
Filing Dt:
|
04/30/2004
|
Publication #:
|
|
Pub Dt:
|
11/03/2005
| | | | |
Title:
|
HEAT SPREADER FOR THERMALLY ENHANCED SEMICONDUCTOR PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
10/31/2006
|
Application #:
|
10837347
|
Filing Dt:
|
04/30/2004
|
Publication #:
|
|
Pub Dt:
|
11/17/2005
| | | | |
Title:
|
LARGE DIE PACKAGE STRUCTURES AND FABRICATION METHOD THEREFOR
|
|
|
Patent #:
|
|
Issue Dt:
|
06/13/2006
|
Application #:
|
10846171
|
Filing Dt:
|
05/13/2004
|
Publication #:
|
|
Pub Dt:
|
11/24/2005
| | | | |
Title:
|
DUAL ROW LEADFRAME AND FABRICATION METHOD
|
|
|
Patent #:
|
|
Issue Dt:
|
02/28/2006
|
Application #:
|
10846176
|
Filing Dt:
|
05/13/2004
|
Publication #:
|
|
Pub Dt:
|
11/17/2005
| | | | |
Title:
|
METHOD OF MANUFACTURING DIFFERENT BOND PADS ON THE SAME SUBSTRATE OF AN INTEGRATED CIRCUIT PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
05/15/2007
|
Application #:
|
10850220
|
Filing Dt:
|
05/19/2004
|
Publication #:
|
|
Pub Dt:
|
12/16/2004
| | | | |
Title:
|
INTEGRATED CIRCUIT PACKAGE WITH LEADFRAME LOCKED ENCAPSULATION AND METHOD OF MANUFACTURE THEREFOR
|
|
|
Patent #:
|
|
Issue Dt:
|
08/15/2006
|
Application #:
|
10850934
|
Filing Dt:
|
05/20/2004
|
Publication #:
|
|
Pub Dt:
|
11/24/2005
| | | | |
Title:
|
PACKAGING FOR OPTOELECTRONIC DEVICES
|
|
|
Patent #:
|
|
Issue Dt:
|
03/07/2006
|
Application #:
|
10866561
|
Filing Dt:
|
06/10/2004
|
Publication #:
|
|
Pub Dt:
|
12/15/2005
| | | | |
Title:
|
CHIP SCALE PACKAGE WITH OPEN SUBSTRATE
|
|
|
Patent #:
|
|
Issue Dt:
|
07/10/2007
|
Application #:
|
10894561
|
Filing Dt:
|
07/19/2004
|
Publication #:
|
|
Pub Dt:
|
01/19/2006
| | | | |
Title:
|
INTEGRATED CIRCUIT DIE WITH PEDESTAL
|
|
|
Patent #:
|
|
Issue Dt:
|
06/03/2008
|
Application #:
|
10913806
|
Filing Dt:
|
08/05/2004
|
Publication #:
|
|
Pub Dt:
|
02/09/2006
| | | | |
Title:
|
METHOD AND APPARATUS FOR STACKED DIE PACKAGING
|
|
|
Patent #:
|
|
Issue Dt:
|
11/01/2005
|
Application #:
|
10914870
|
Filing Dt:
|
08/09/2004
|
Publication #:
|
|
Pub Dt:
|
01/13/2005
| | | | |
Title:
|
SEMICONDUCTOR DEVICE PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
01/04/2011
|
Application #:
|
10921377
|
Filing Dt:
|
08/18/2004
|
Publication #:
|
|
Pub Dt:
|
03/03/2005
| | | | |
Title:
|
ARRAY-MOLDED PACKAGE HEAT SPREADER AND FABRICATION METHOD THEREFOR
|
|
|
Patent #:
|
|
Issue Dt:
|
12/27/2005
|
Application #:
|
10969361
|
Filing Dt:
|
10/19/2004
|
Publication #:
|
|
Pub Dt:
|
03/10/2005
| | | | |
Title:
|
INTEGRATED CIRCUIT PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
12/18/2007
|
Application #:
|
10986510
|
Filing Dt:
|
11/10/2004
|
Publication #:
|
|
Pub Dt:
|
04/28/2005
| | | | |
Title:
|
STACKED SEMICONDUCTOR PACKAGES
|
|
|
Patent #:
|
|
Issue Dt:
|
08/15/2006
|
Application #:
|
10993526
|
Filing Dt:
|
11/18/2004
|
Publication #:
|
|
Pub Dt:
|
04/28/2005
| | | | |
Title:
|
SEMICONDUCTOR PACKAGES AND LEADFRAME ASSEMBLIES
|
|
|
Patent #:
|
|
Issue Dt:
|
08/07/2007
|
Application #:
|
11022375
|
Filing Dt:
|
12/23/2004
|
Publication #:
|
|
Pub Dt:
|
01/19/2006
| | | | |
Title:
|
SEMICONDUCTOR MULTIPACKAGE MODULE INCLUDING DIE AND INVERTED LAND GRID ARRAY PACKAGE STACKED OVER BALL GRID ARRAY PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
12/01/2009
|
Application #:
|
11164329
|
Filing Dt:
|
11/18/2005
|
Publication #:
|
|
Pub Dt:
|
03/16/2006
| | | | |
Title:
|
INTEGRATED CIRCUIT PACKAGE WITH OPEN SUBSTRATE
|
|
|
Patent #:
|
|
Issue Dt:
|
09/29/2009
|
Application #:
|
11169850
|
Filing Dt:
|
06/28/2005
|
Publication #:
|
|
Pub Dt:
|
10/27/2005
| | | | |
Title:
|
SEMICONDUCTOR PACKAGE FOR A LARGE DIE
|
|
|
Patent #:
|
|
Issue Dt:
|
10/28/2008
|
Application #:
|
11306352
|
Filing Dt:
|
12/23/2005
|
Publication #:
|
|
Pub Dt:
|
09/07/2006
| | | | |
Title:
|
SYSTEM FOR DIFFERENT BOND PADS IN AN INTEGRATED CIRCUIT PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
06/14/2011
|
Application #:
|
11306354
|
Filing Dt:
|
12/23/2005
|
Publication #:
|
|
Pub Dt:
|
09/07/2006
| | | | |
Title:
|
SEMICONDUCTOR PACKAGE WITH PASSIVE DEVICE INTEGRATION
|
|
|
Patent #:
|
|
Issue Dt:
|
01/23/2007
|
Application #:
|
11372988
|
Filing Dt:
|
03/10/2006
|
Publication #:
|
|
Pub Dt:
|
08/03/2006
| | | | |
Title:
|
METHOD OF FABRICATING A SEMICONDUCTOR STACKED MULIT-PACKAGE MODULE HAVING INVERTED SECOND PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
01/30/2007
|
Application #:
|
11374378
|
Filing Dt:
|
03/13/2006
|
Publication #:
|
|
Pub Dt:
|
08/03/2006
| | | | |
Title:
|
METHOD OF FABRICATING A SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING INVERTED LAND GRID ARRAY (LGA) PACKAGE STACKED OVER BALL GRID ARRAY (BGA) PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
03/04/2008
|
Application #:
|
11379740
|
Filing Dt:
|
04/21/2006
|
Publication #:
|
|
Pub Dt:
|
08/24/2006
| | | | |
Title:
|
DUAL ROW LEADFRAME AND FABRICATION METHOD
|
|
|
Patent #:
|
|
Issue Dt:
|
06/09/2009
|
Application #:
|
11456544
|
Filing Dt:
|
07/10/2006
|
Publication #:
|
|
Pub Dt:
|
01/10/2008
| | | | |
Title:
|
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH STIFFENER
|
|
|
Patent #:
|
|
Issue Dt:
|
04/20/2010
|
Application #:
|
11536544
|
Filing Dt:
|
09/28/2006
|
Publication #:
|
|
Pub Dt:
|
01/25/2007
| | | | |
Title:
|
LARGE DIE PACKAGE STRUCTURES AND FABRICATION METHOD THEREFOR
|
|
|
Patent #:
|
|
Issue Dt:
|
04/29/2008
|
Application #:
|
11626272
|
Filing Dt:
|
01/23/2007
|
Publication #:
|
|
Pub Dt:
|
05/24/2007
| | | | |
Title:
|
METHOD OF FABRICATING A SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING INVERTED LAND GRID ARRAY (LGA) PACKAGE STACKED OVER BALL GRID ARRAY (BGA) PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
08/19/2008
|
Application #:
|
11697779
|
Filing Dt:
|
04/09/2007
|
Publication #:
|
|
Pub Dt:
|
08/16/2007
| | | | |
Title:
|
INTEGRATED CIRCUIT PACKAGE WITH LEADFRAME LOCKED ENCAPSULATION AND METHOD OF MANUFACTURE THEREFOR
|
|
|
Patent #:
|
|
Issue Dt:
|
08/31/2010
|
Application #:
|
11760690
|
Filing Dt:
|
06/08/2007
|
Publication #:
|
|
Pub Dt:
|
10/04/2007
| | | | |
Title:
|
INTEGRATED CIRCUIT DIE WITH PEDESTAL
|
|
|
Patent #:
|
|
Issue Dt:
|
04/06/2010
|
Application #:
|
11772776
|
Filing Dt:
|
07/02/2007
|
Publication #:
|
|
Pub Dt:
|
12/06/2007
| | | | |
Title:
|
SEMICONDUCTOR MULTIPACKAGE MODULE INCLUDING DIE AND INVERTED LAND GRID ARRAY PACKAGE STACKED OVER BALL GRID ARRAY PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
03/16/2010
|
Application #:
|
11859462
|
Filing Dt:
|
09/21/2007
|
Publication #:
|
|
Pub Dt:
|
03/26/2009
| | | | |
Title:
|
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PASSIVE COMPONENTS
|
|
|
Patent #:
|
|
Issue Dt:
|
03/16/2010
|
Application #:
|
12236227
|
Filing Dt:
|
09/23/2008
|
Publication #:
|
|
Pub Dt:
|
01/29/2009
| | | | |
Title:
|
STACKED INTEGRATED CIRCUIT LEADFRAME PACKAGE SYSTEM
|
|
|
Patent #:
|
|
Issue Dt:
|
08/19/2014
|
Application #:
|
12484245
|
Filing Dt:
|
06/14/2009
|
Publication #:
|
|
Pub Dt:
|
12/16/2010
| | | | |
Title:
|
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH HIGH LEAD COUNT AND METHOD OF MANUFACTURE THEREOF
|
|
|
Patent #:
|
|
Issue Dt:
|
06/26/2012
|
Application #:
|
12498163
|
Filing Dt:
|
07/06/2009
|
Publication #:
|
|
Pub Dt:
|
11/05/2009
| | | | |
Title:
|
SEMICONDUCTOR PACKAGE HEAT SPREADER
|
|
|
Patent #:
|
|
Issue Dt:
|
10/04/2011
|
Application #:
|
12582587
|
Filing Dt:
|
10/20/2009
|
Publication #:
|
|
Pub Dt:
|
02/18/2010
| | | | |
Title:
|
INTEGRATED CIRCUIT PACKAGE WITH OPEN SUBSTRATE
|
|
|
Patent #:
|
|
Issue Dt:
|
07/28/2015
|
Application #:
|
12965018
|
Filing Dt:
|
12/10/2010
|
Publication #:
|
|
Pub Dt:
|
06/14/2012
| | | | |
Title:
|
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH VERTICAL INTERCONNECTION AND METHOD OF MANUFACTURE THEREOF
|
|
|
Patent #:
|
|
Issue Dt:
|
03/06/2012
|
Application #:
|
13178331
|
Filing Dt:
|
07/07/2011
|
Publication #:
|
|
Pub Dt:
|
11/03/2011
| | | | |
Title:
|
WIRE BOND INTERCONNECTION AND METHOD OF MANUFACTURE THEREOF
|
|
|
Patent #:
|
|
Issue Dt:
|
07/09/2013
|
Application #:
|
13241141
|
Filing Dt:
|
09/22/2011
|
Publication #:
|
|
Pub Dt:
|
03/28/2013
| | | | |
Title:
|
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DUAL CONNECTION AND METHOD OF MANUFACTURE THEREOF
|
|
|
Patent #:
|
|
Issue Dt:
|
05/19/2015
|
Application #:
|
13247890
|
Filing Dt:
|
09/28/2011
|
Publication #:
|
|
Pub Dt:
|
01/26/2012
| | | | |
Title:
|
INTEGRATED CIRCUIT PACKAGE WITH OPEN SUBSTRATE AND METHOD OF MANUFACTURING THEREOF
|
|
|
Patent #:
|
|
Issue Dt:
|
07/28/2015
|
Application #:
|
14037110
|
Filing Dt:
|
09/25/2013
|
Publication #:
|
|
Pub Dt:
|
03/26/2015
| | | | |
Title:
|
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH HEAT SPREADER AND METHOD OF MANUFACTURE THEREOF
|
|
|
Patent #:
|
|
Issue Dt:
|
08/11/2015
|
Application #:
|
14038577
|
Filing Dt:
|
09/26/2013
|
Title:
|
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ROUTABLE TRACES AND METHOD OF MANUFACTURE THEREOF
|
|
|
Patent #:
|
|
Issue Dt:
|
07/28/2015
|
Application #:
|
14137352
|
Filing Dt:
|
12/20/2013
|
Title:
|
METHOD OF MANUFACTURE OF INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PLASMA PROCESSING
|
|