Patent Assignment Details
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Reel/Frame: | 058429/0400 | |
| Pages: | 3 |
| | Recorded: | 12/20/2021 | | |
Attorney Dkt #: | 1012-3105 / 2021P04593 US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17555709
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Filing Dt:
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12/20/2021
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Publication #:
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Pub Dt:
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06/22/2023
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Title:
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METHOD OF PROCESSING A SEMICONDUCTOR WAFER, SEMICONDUCTOR DIE, AND METHOD OF PRODUCING A SEMICONDUCTOR MODULE
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Assignee
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AM CAMPEON 1-15 |
NEUBIBERG, GERMANY 85579 |
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Correspondence name and address
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MURPHY, BILAK & HOMILLER, PLLC
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PO BOX 1959
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CARY, NC 27572-1959
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09/25/2024 02:54 AM
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