Patent Assignment Details
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Reel/Frame: | 014710/0401 | |
| Pages: | 3 |
| | Recorded: | 06/09/2004 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/04/2006
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Application #:
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10709954
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Filing Dt:
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06/09/2004
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Publication #:
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Pub Dt:
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02/17/2005
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Title:
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ELECTRICAL PACKAGE CAPABLE OF INCREASING THE DENSITY OF BONDING PADS AND FINE CIRCUIT LINES INSIDE A INTERCONNECTION
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Assignee
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8F, NO. 533, CHUNG-CHENG RD., HSIN-TIEN CITY |
TAIPEI HSIEN, TAIWAN |
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Correspondence name and address
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JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE
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7 FLOOR-1, NO. 100
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ROOSEVELT ROAD, SECTION 2
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TAIPEI, TAIWAN 100
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