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Patent Assignment Details
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Reel/Frame:037332/0402   Pages: 12
Recorded: 12/18/2015
Conveyance: MERGER (SEE DOCUMENT FOR DETAILS).
Total properties: 12
1
Patent #:
Issue Dt:
11/13/2012
Application #:
12769848
Filing Dt:
04/29/2010
Publication #:
Pub Dt:
11/03/2011
Title:
IMAGE SENSING DEVICE HAVING THIN THICKNESS
2
Patent #:
Issue Dt:
10/22/2013
Application #:
12774795
Filing Dt:
05/06/2010
Publication #:
Pub Dt:
11/10/2011
Title:
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
3
Patent #:
Issue Dt:
06/11/2013
Application #:
12774811
Filing Dt:
05/06/2010
Publication #:
Pub Dt:
11/10/2011
Title:
SEMICONDUCTOR DEVICE PACKAGING STRUCTURE AND PACKAGING METHOD
4
Patent #:
Issue Dt:
02/03/2015
Application #:
12774823
Filing Dt:
05/06/2010
Publication #:
Pub Dt:
11/10/2011
Title:
SEMICONDUCTOR PROCESS AND STRUCTURE
5
Patent #:
Issue Dt:
10/23/2012
Application #:
12775114
Filing Dt:
05/06/2010
Publication #:
Pub Dt:
11/10/2011
Title:
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
6
Patent #:
Issue Dt:
01/07/2014
Application #:
12831386
Filing Dt:
07/07/2010
Publication #:
Pub Dt:
01/12/2012
Title:
PACKAGE PROCESS OF BACKSIDE ILLUMINATION IMAGE SENSOR
7
Patent #:
Issue Dt:
09/18/2012
Application #:
12831431
Filing Dt:
07/07/2010
Publication #:
Pub Dt:
01/12/2012
Title:
SILICON BASED SUBSTRATE AND MANUFACTURING METHOD THEREOF
8
Patent #:
Issue Dt:
12/04/2012
Application #:
12855765
Filing Dt:
08/13/2010
Publication #:
Pub Dt:
02/16/2012
Title:
STACKING METHOD AND STACKING CARRIER
9
Patent #:
Issue Dt:
04/01/2014
Application #:
13655374
Filing Dt:
10/18/2012
Publication #:
Pub Dt:
05/09/2013
Title:
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
10
Patent #:
Issue Dt:
03/17/2015
Application #:
13665743
Filing Dt:
10/31/2012
Publication #:
Pub Dt:
03/07/2013
Title:
IMAGE SENSING DEVICE
11
Patent #:
Issue Dt:
03/08/2016
Application #:
13668245
Filing Dt:
11/03/2012
Publication #:
Pub Dt:
03/14/2013
Title:
PACKAGE PROCESS OF BACKSIDE ILLUMINATION IMAGE SENSOR
12
Patent #:
Issue Dt:
06/30/2015
Application #:
13908246
Filing Dt:
06/03/2013
Publication #:
Pub Dt:
10/03/2013
Title:
SEMICONDUCTOR DEVICE PACKAGING STRUCTURE AND PACKAGING METHOD
Assignor
1
Exec Dt:
08/26/2015
Assignee
1
2711 CENTERVILLE RD
SUITE 400
WILMINGTON, DELAWARE 19808
Correspondence name and address
FOLEY & LARDNER LLP
150 EAST GILMAN ST.
VEREX PLAZA
MADISON, WI 53703

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