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Reel/Frame:063647/0402   Pages: 5
Recorded: 05/15/2023
Attorney Dkt #:YX23_0004UP
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
18197607
Filing Dt:
05/15/2023
Publication #:
Pub Dt:
11/23/2023
Title:
Flip-Chip Packaged Power Transistor Module Having Built-in Gate Driver
Assignors
1
Exec Dt:
05/11/2023
2
Exec Dt:
05/11/2023
3
Exec Dt:
05/11/2023
4
Exec Dt:
05/11/2023
5
Exec Dt:
05/11/2023
6
Exec Dt:
05/11/2023
7
Exec Dt:
05/11/2023
Assignees
1
NO.526, NANSHANG RD., GUISHAN DIST,
TAOYUAN, TAIWAN 333014
2
NO.32, GONG 5 RD., LONGTAN,
TAOYUAN, TAIWAN 325019
Correspondence name and address
CHEYANG CHEN
17700 CASTLETON ST, SUITE 373,
CITY OF INDUSTRY, CA 91748

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