Patent Assignment Details
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Reel/Frame: | 013946/0404 | |
| Pages: | 4 |
| | Recorded: | 01/30/2003 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/16/2005
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Application #:
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10343519
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Filing Dt:
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01/30/2003
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Publication #:
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Pub Dt:
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07/31/2003
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Title:
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HIGH RELIABILITY NON-CONDUCTIVE ADHESIVES FOR NON-SOLDER FLIP CHIP BONDINGS AND FLIP CHIP BONDING METHOD USING THE SAME
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Assignees
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373-1 KUSONG-DONG, YUSONG-GU |
TAEJON 305-701, KOREA, REPUBLIC OF |
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#401 YOUNGDO CAPITAL BLDG., 218-1 OKSU-DONG, SUNGDONG-KU |
SEOUL 133-839, KOREA, REPUBLIC OF |
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Correspondence name and address
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MARGER JOHNSON & MCCOLLOM, P.C.
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HOSOON LEE
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1030 S.W. MORRISON STREET
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PORTLAND, OR 97205
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