Patent Assignment Details
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Reel/Frame: | 050370/0404 | |
| Pages: | 3 |
| | Recorded: | 09/12/2019 | | |
Attorney Dkt #: | 82137477US01 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/26/2021
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Application #:
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16563743
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Filing Dt:
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09/06/2019
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Title:
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AMPLIFIER DIE BOND PAD DESIGN AND AMPLIFIER DIE ARRANGEMENT FOR COMPACT DOHERTY AMPLIFIER MODULES
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Assignee
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6501 WILLIAM CANNON DRIVE WEST |
AUSTIN, TEXAS 78735 |
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Correspondence name and address
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NXP USA, INC. LAW DEPARTMENT
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6501 WILLIAM CANNON DRIVE WEST TX30/OE62
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AUSTIN, TX 78735
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