Patent Assignment Details
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Reel/Frame: | 008317/0406 | |
| Pages: | 2 |
| | Recorded: | 12/27/1996 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/23/1999
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Application #:
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08727973
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Filing Dt:
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10/09/1996
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Title:
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CIRCUIT BOARD, MANUFACTURING METHOD THEREFOR, AND BUMP-TYPE CONTACT HEAD AND SEMICONDUCTOR COMPONENT PACKAGING MODULE USING THE CIRCUIT BOARD
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Assignees
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14-1, OGAMI 5-CHOME, AYASE-SHI |
KANAGAWA, JAPAN |
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15-15-105, DAITA 3-CHOME, SETAGAWA-KU |
TOKYO, JAPAN |
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Correspondence name and address
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FRISHAUF, HOLTZ, GOODMAN, LANGER & CHICK
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ATTN: LEONARD HOLTZ
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767 THIRD AVENUE
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25TH FLOOR
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NEW YORK, NY 10017-2023
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