Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 046299/0409 | |
| Pages: | 6 |
| | Recorded: | 07/09/2018 | | |
| Attorney Dkt #: | 77549-US-PA |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/17/2020
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Application #:
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16030826
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Filing Dt:
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07/09/2018
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Publication #:
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Pub Dt:
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01/09/2020
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Title:
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Semiconductor package with a conductive casing for heat dissipation and electromagnetic interference (EMI) shield and manufacturing method thereof
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Assignee
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| NO.26, DATONG RD., HUKOU TOWNSHIP, |
| HSINCHU COUNTY, TAIWAN 30352 |
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Correspondence name and address
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JCIPRNET
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P.O. BOX 600 TAIPEI GUTING
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TAIPEI CITY, 10099 TAIWAN
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06/17/2024 02:48 PM
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