Patent Assignment Details
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Reel/Frame: | 052679/0409 | |
| Pages: | 3 |
| | Recorded: | 05/15/2020 | | |
Attorney Dkt #: | FIP-48116 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/06/2022
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Application #:
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16764646
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Filing Dt:
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05/15/2020
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Publication #:
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Pub Dt:
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09/10/2020
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Title:
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RESIN COMPOSITION, SEMICONDUCTOR SEALING MATERIAL, ONE-PART ADHESIVE AND ADHESIVE FILM
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Assignee
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3993, NIGORIKAWA, KITA-KU, NIIGATA-SHI |
NIIGATA, JAPAN 950-3131 |
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Correspondence name and address
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RANKIN, HILL & CLARK LLP
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38210 GLENN AVENUE
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WILLOUGHBY, OH 44094
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06/25/2024 09:22 AM
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