Patent Assignment Details
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Reel/Frame: | 012860/0411 | |
| Pages: | 5 |
| | Recorded: | 04/29/2002 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/26/2003
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Application #:
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10014129
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Filing Dt:
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11/16/2001
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Publication #:
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Pub Dt:
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05/22/2003
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Title:
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INTEGRATED VOID-FREE PROCESS FOR ASSEMBLING A SOLDER BUMPED CHIP
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Assignee
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1676 LINCOLN AVENUE |
UTICA, NEW YORK 13503 |
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Correspondence name and address
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GAGNEBIN & LEBOVICI LLP
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WEINGARTEN, SCHURGIN
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TEN POST OFFICE SQUARE
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BOSTON, MA 02109
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