Patent Assignment Details
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Reel/Frame: | 010183/0414 | |
| Pages: | 14 |
| | Recorded: | 08/17/1999 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/21/2001
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Application #:
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09375561
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Filing Dt:
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08/17/1999
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Title:
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MULTILEVEL INTERCONNECT STRUCTURE WITH LOW-K DIELECTRIC AND METHOD OF FABRICATING THE STRUCTURE
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Assignee
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8000 S. FEDERAL WAY |
BOISE, IOWA 80707 |
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Correspondence name and address
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DICKSTEIN SHAPIRO MORIN, ET AL.
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ATTN: THOMAS J. D'AMICO
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2101 L STREET NW
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WASHINGTON, DC 20037-1526
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