Patent Assignment Details
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Reel/Frame: | 022883/0414 | |
| Pages: | 2 |
| | Recorded: | 06/23/2009 | | |
Attorney Dkt #: | FUJ-078 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12453453
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Filing Dt:
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05/12/2009
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Publication #:
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Pub Dt:
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11/26/2009
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Title:
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Semiconductor device with insulating substrate joined to heat radiator
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Assignee
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11-2 OSAKI 1-CHOME, SHINAGAWA-KU |
TOKYO, JAPAN 141-0032 |
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Correspondence name and address
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KANESAKA BERNER & PARTNERS
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1700 DIAGONAL ROAD, SUITE 310
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ALEXANDRIA, VA 22314
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