Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 017643/0415 | |
| Pages: | 3 |
| | Recorded: | 05/19/2006 | | |
| Attorney Dkt #: | 60291.000041 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/06/2009
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Application #:
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10553470
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Filing Dt:
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05/19/2006
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Publication #:
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Pub Dt:
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12/28/2006
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Title:
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MONITORING THE REDUCTION IN THICKNESS AS MATERIAL IS REMOVED FROM A WAFER COMPOSITE AND TEST STRUCTURE FOR MONITORING REMOVAL OF MATERIAL
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Assignee
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| HAARBERGSTR. 67 |
| ERFURT, GERMANY 99097 |
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Correspondence name and address
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HUNTON & WILLIAMS LLP
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1900 K STREET, NW
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SUITE 1200
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WASHINGTON, DC 20006
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