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Total properties:
69
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Patent #:
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Issue Dt:
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01/13/1987
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Application #:
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06837543
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Filing Dt:
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03/10/1986
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Title:
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SILVER-GLASS PASTE FOR ATTACHMENT OF SILICON DIE TO CERAMIC SUBSTRATES
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Patent #:
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Issue Dt:
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07/19/1988
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Application #:
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06916307
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Filing Dt:
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10/07/1986
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Title:
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METHOD OF MANUFACTURE PREFORMS
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Patent #:
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Issue Dt:
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08/02/1988
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Application #:
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07001661
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Filing Dt:
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01/08/1987
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Title:
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SILVER-GLASS PASTE WITH POLY-MODAL FLAKE SIZE DISTRIBUTION AND QUICK DRY VEHICLE
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Patent #:
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Issue Dt:
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05/02/1989
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Application #:
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07027795
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Filing Dt:
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03/19/1987
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Title:
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ENCAPSULATING ELECTRONIC COMPONENTS
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Patent #:
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Issue Dt:
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03/26/1991
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Application #:
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07132285
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Filing Dt:
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12/15/1987
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Title:
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TOUGHENED PREPREGS AND FORMULATIONS
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Patent #:
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Issue Dt:
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02/12/1991
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Application #:
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07132286
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Filing Dt:
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12/15/1987
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Title:
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INORGANIC WHISKER CONTAINING IMPACT ENHANCED PREPREGS AND FORMULATIONS FORMULATIONS
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Patent #:
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Issue Dt:
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09/19/1989
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Application #:
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07231155
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Filing Dt:
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08/11/1988
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Title:
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ABRASION-RESISTANT COATING
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Patent #:
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Issue Dt:
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01/08/1991
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Application #:
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07237515
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Filing Dt:
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08/26/1988
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Title:
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METHOD FOR MAKING ORGANOSILAZANES
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Patent #:
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Issue Dt:
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11/06/1990
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Application #:
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07334307
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Filing Dt:
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04/06/1989
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Title:
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SILVER-GLASS DIE ATTACH PASTE WITH REDUCED RESIN
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Patent #:
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Issue Dt:
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02/19/1991
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Application #:
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07381753
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Filing Dt:
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07/18/1989
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Title:
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NOVEL CIRCUIT BOARDS
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Patent #:
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Issue Dt:
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08/20/1991
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Application #:
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07418757
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Filing Dt:
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10/05/1989
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Title:
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METHOD OF ENCAPSULATING A SEMICONDUCTOR DEVICE WITH A FLAME RETARDANT EPOXY MOLDING COMPOUND
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Patent #:
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Issue Dt:
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12/29/1992
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Application #:
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07458314
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Filing Dt:
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12/28/1989
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Title:
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POLYIMIDE WITH REDUCED ANHYDRIDE CONTENT
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Patent #:
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Issue Dt:
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04/14/1992
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Application #:
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07590247
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Filing Dt:
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09/28/1990
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Title:
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METHOD OF ENCAPSULATING A SEMICONDUCTOR DEVICE WITH A FLAME RETARDANT EPOXY MOLDING COMPOUND
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Patent #:
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Issue Dt:
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10/13/1992
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Application #:
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07692749
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Filing Dt:
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05/22/1991
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Title:
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FLAME RETARDANT EPOXY MOLDING COMPOUND, METHOD AND ENCAPSULATED DEVICE
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Patent #:
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Issue Dt:
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08/16/1994
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07692863
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Filing Dt:
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05/22/1991
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Title:
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FLAME RETARDANT EPOXY MOLDING COMPOUND FOR ENCAPSULATING A SEMICONDUCTOR DEVICE
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Patent #:
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Issue Dt:
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08/10/1993
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Application #:
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07693695
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Filing Dt:
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04/30/1991
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Title:
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EXPANDABLE FILMS AND MOLDED PRODUCTS THEREFROM
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Patent #:
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Issue Dt:
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10/27/1992
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Application #:
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07704665
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Filing Dt:
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05/20/1991
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Title:
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ENCAPSULATING ELECTRONIC COMPONENTS
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Patent #:
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Issue Dt:
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12/06/1994
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Application #:
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07728642
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Filing Dt:
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07/11/1991
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Title:
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LIGHTNING STRIKE COMPOSITE AND PROCESS
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Patent #:
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Issue Dt:
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08/03/1993
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Application #:
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07774417
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Filing Dt:
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10/09/1991
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Title:
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ADHESIVE BONDING COMPOSITION WITH BOND LINE LIMITING SPACER SYSTEM
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Patent #:
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Issue Dt:
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01/03/1995
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Application #:
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07876015
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Filing Dt:
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04/30/1992
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Title:
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WATERBORNE EPOXY DERIVATIVE COMPOSITION
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Patent #:
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Issue Dt:
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11/09/1993
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Application #:
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07876016
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Filing Dt:
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04/30/1992
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Title:
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CORROSION RESISTANT WATERBONE ADHESIVE PRIMERS
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Patent #:
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Issue Dt:
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05/24/1994
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Application #:
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07911176
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Filing Dt:
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07/09/1992
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Title:
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DIE ADHESION TESTING METHOD AND APPARATUS
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Patent #:
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Issue Dt:
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11/30/1993
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Application #:
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07917582
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Filing Dt:
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07/21/1992
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Title:
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WATERBORNE EPOXY DERIVED ADHESIVE PRIMERS
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Patent #:
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Issue Dt:
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09/09/1997
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Application #:
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07945176
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Filing Dt:
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09/15/1992
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Title:
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LOW MOISTURE ABSORPTION SYNTACTIC FOAM
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Patent #:
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Issue Dt:
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08/02/1994
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Application #:
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07962924
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Filing Dt:
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10/19/1992
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Title:
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LOW TEMPERATURE GLASS WITH IMPROVED THERMAL STRESS PROPERTIES AND METHOD OF USE
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Patent #:
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Issue Dt:
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04/26/1994
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Application #:
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08002308
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Filing Dt:
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01/08/1993
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Title:
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RESINLESS PSEUDOPLASTIC BONDING COMPOSITIONS
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Patent #:
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Issue Dt:
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02/06/1996
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Application #:
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08023595
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Filing Dt:
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02/26/1993
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Title:
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FREEZE RESISTANT DIE-ATTACH COMPOSITIONS
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Patent #:
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Issue Dt:
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10/25/1994
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Application #:
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08023962
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Filing Dt:
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02/26/1993
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Title:
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DIE-ATTACH COMPOSITION COMPRISING POLYCYANATE ESTER MONOMER
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Patent #:
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Issue Dt:
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12/19/1995
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Application #:
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08024630
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Filing Dt:
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03/01/1993
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Title:
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FLAME RETARDANT EPOXY MOLDING COMPOUND, METHOD AND ENCAPSULATED DEVICE
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Patent #:
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Issue Dt:
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08/09/1994
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Application #:
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08030702
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03/12/1993
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Title:
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MANUALLY OPERABLE DIE ATTACH APPARATUS
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Patent #:
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Issue Dt:
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03/21/1995
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Application #:
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08035736
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Filing Dt:
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03/23/1993
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Title:
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METHOD OF USING MOLD RELEASE AGENTS
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Patent #:
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Issue Dt:
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12/27/1994
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08037262
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03/26/1993
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Title:
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HOT MELT ADHESIVE SPRAY DISPENSER
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Patent #:
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Issue Dt:
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02/21/1995
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Application #:
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08100052
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07/30/1993
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Title:
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ADHESIVE PASTE CONTAINING POLYMERIC RESIN
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Patent #:
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Issue Dt:
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03/14/1995
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Application #:
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08103988
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08/10/1993
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Title:
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EXPANDABLE FILMS AND MOLDED PRODUCTS THEREFROM
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Patent #:
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Issue Dt:
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09/05/1995
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Application #:
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08157665
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11/23/1993
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Title:
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SOLVENT FREE DIE-ATTACH COMPOSITION
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Patent #:
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Issue Dt:
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04/04/1995
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08188042
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Filing Dt:
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01/27/1994
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Title:
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RESINLESS PSEUDOPLASTIC BONDING COMPOSITIONS
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Patent #:
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Issue Dt:
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05/09/1995
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Application #:
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08191350
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Filing Dt:
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02/03/1994
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Title:
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SEMICONDUCTOR DEVICE ENCAPSULATED WITH A FLAME RETARDANT EPOXY MOLDING COMPOUND
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Patent #:
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Issue Dt:
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05/30/1995
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Application #:
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08191351
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Filing Dt:
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02/03/1994
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Title:
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FLAME-RETARDANT EPOXY MOLDING COMPOUND
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Patent #:
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Issue Dt:
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03/14/1995
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Application #:
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08232886
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04/25/1994
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Title:
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MULTILAYER COMPOSITE ARTICLE CONTAINING A MULTIMODAL COMBATION OF FILLER PARTICLES
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Patent #:
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08/06/1996
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Application #:
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08265919
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06/27/1994
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Title:
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LOW TEMPERATURE GLASS PASTE WITH IMPROVED THERMAL STRESS PROPERTIES
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Patent #:
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Issue Dt:
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03/07/2000
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08300721
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09/02/1994
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BISMALEIMIDE-DIVINYL ADHESIVE COMPOSITIONS AND USES THEREFOR
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08/26/1997
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08352259
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12/08/1994
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ORIENTED EXPANDED MOLDED PRODUCTS
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Issue Dt:
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07/30/1996
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Application #:
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08400069
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03/07/1995
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Title:
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EXPANDABLE FILMS AND MOLDED PRODUCTS THEREFROM
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Patent #:
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Issue Dt:
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11/28/1995
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08400070
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03/07/1995
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PROCESS OF MAKING A LIGHTING STRIKE COMPOSITE
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03/07/2000
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08460495
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06/02/1995
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THERMOSETTING RESIN COMPOSITIONS CONTAINING MALEIMIDE AND/OR VINYL COMPOUNDS
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06/09/1998
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08474439
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06/07/1995
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METHOD FOR MAKING A CONDUCTIVE FILM COMPOSITE
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07/27/1999
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08474929
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06/07/1995
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Title:
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CONDUCTIVE FILM COMPOSITE
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Patent #:
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Issue Dt:
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07/08/1997
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08475006
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06/07/1995
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Title:
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BLEED RESISTANT CYANATE ESTER-CONTAINING COMPOSITIONS
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Patent #:
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02/17/1998
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08483342
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06/07/1995
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Title:
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METHOD FOR MAKING A DEBOSSED CONDUCTIVE FILM COMPOSITE
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03/24/1998
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08488469
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06/07/1995
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DEBOSSABLE FILMS
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09/30/1997
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08585873
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01/12/1996
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LONG OPEN TIME POLYAMIDE COMPOSITIONS
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07/21/1998
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08597021
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02/05/1996
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EXPANDABLE FILMS AND MOLDED PRODUCTS THEREFROM
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09/02/1997
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08654852
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05/29/1996
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LOW TEMPERATURE GLASS PASTE WITH HIGH METAL TO GLASS RATIO
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01/19/1999
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08684148
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07/19/1996
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METHOD FOR ISOMERIZATION OF ARYLPROPARGYL ETHER MONOMERS AND USES THEREFOR
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05/19/1998
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08687363
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08/02/1996
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BLEED RESISTANT CYANATE ESTER-CONTAINING COMPOSITIONS
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02/10/1998
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08688206
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07/29/1996
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PERFLUORINATED HYDROCARBON POLYMER-FILLED ADHESIVE FORMULATIONS AND USES THEREFOR
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02/03/1998
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08694903
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08/09/1996
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PROPARGYL ETHER-CONTAINING COMPOSITIONS USEFUL FOR UNDERFILL APPLICATIONS
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08/04/1998
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08711982
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09/10/1996
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MALEMIDE CONTAINING FORMULATIONS ANND USES THEREFOR
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05/18/1999
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08724993
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10/03/1996
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METHOD FOR THE PREPARATION OF LEAD-ON-CHIP ASSEMBLIES
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10/19/1999
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06/20/1997
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EPOXY-CONTAINING DIE-ATTACH COMPOSITIONS
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09/19/2000
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09/22/1997
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HYDROPHOBIC VINYL MONOMERS, FORMULATIONS CONTAINING SAME, AND USES THEREFOR
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10/26/1999
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03/02/1998
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METHOD FOR THE PREPARATION OF MALEIMIDES
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02/13/2001
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06/29/1998
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MALEIMIDE CONTAINING FORMULATIONS AND USES THEREFOR
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05/24/1999
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05/30/2002
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Title:
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METHODS FOR REDUCING VOID FORMATION UPON CURING OF ADHESIVE FORMULATIONS AND COMPOSITIONS USEFUL THEREFOR
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08/06/2002
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07/01/1999
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04/03/2001
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07/28/1999
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LOW VISCOSITY ACRYLATE MONOMERS FORMULATIONS CONTAINING SAME AND USES THEREFOR
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04/03/2001
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05/23/2000
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10/07/2003
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07/21/2000
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MONOLITHIC EXPANDABLE STRUCTURES, METHODS OF MANUFACTURE AND COMPOSITE STRUCTURES
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91968545
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